A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

In order to provide a process container for carrying out a cleaning process, a drying process, a deburring process, a coating process and/or a coating removal process on a workpiece in the interior of the process container, comprising a wall delimiting the interior of the process container, which is usable in a maintenance-friendly and flexible manner, it is proposed that the process container comprises at least one medium passage, by means of which a medium is guidable through the wall of the process container, at least two different process elements of different types being adaptable to at least one of the medium passages.

Provided that a process for manufacturing an elastic roller having a mandrel and a coating film. The process comprise a first step of forming a coating film on an outer peripheral surface of a first mandrel, and a second step of forming a coating film on an outer peripheral surface of a second mandrel. The process further comprises a cleaning step between the steps. The cleaning step comprising: making a cleaning member arranged coaxially with the central axis of a circular coating head, in a downstream side in a moving direction of the first mandrel with respect to the circular coating head, making the cleaning member relatively approach the circular coating head; bringing a surface to be cleaned into contact with the cleaning member; rotating the cleaning member while the surface comes in contact with the cleaning member; and inserting the cleaning member into the center hole.

Automatic pool cleaners (APCs) and components thereof are detailed. The APCs may include tracks for movement, with the tracks having teethed internal surfaces. The APCs additionally may supply shift mechanisms for purposes of changing direction of their movement and incorporate bladed scrubbers and easily-opening bodies.

A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.

In a holder attached state in which a holder upper part 11 is attached to a brush rotation shaft 2, the lower surface of the holder upper part 11 and the inner peripheral surface of a holder lower part 18 define a brush accommodating space 23, and the inner peripheral edge of a holder bottom plate part 19 defines a circular holder opening 24 having a smaller diameter than the inner diameter of the holder lower part 18. A held part 31 of a brush body 30 is in a circular column shape incapable of penetrating through the holder opening 24, and is accommodated and held in the brush accommodating space 23. A cleaning part 32 of the brush body 30 is in a circular column shape smaller in diameter than the held part 31 and capable of penetrating through the holder opening 24, and penetrates through the holder opening 24 and projects downward. A top-to-bottom length L2 of the holder opening 24 of the brush holder 10 is longer than or equal to of a protruding length L1 of the cleaning part 32 of the brush body 30 from the held part 31 thereof and shorter than the protruding length L1 of the cleaning part 32.

The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.