A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

Automatic pool cleaners (APCs) and components thereof are detailed. The APCs may include tracks for movement, with the tracks having teethed internal surfaces. The APCs additionally may supply shift mechanisms for purposes of changing direction of their movement and incorporate bladed scrubbers and easily-opening bodies.

A method includes performing a first post Chemical Mechanical Polish (CMP) cleaning on a wafer using a first brush. The first brush rotates to clean the wafer. The method further includes performing a second post-CMP cleaning on the wafer using a second brush. The second brush rotates to clean the wafer. The first post-CMP cleaning and the second post-CMP cleaning are performed simultaneously.

A cleaning device for cleaning an atomizer, in particular a rotary atomizer, is provided. The cleaning device includes a wet cleaning station having at least one cleaning nozzle for the wet cleaning of the atomizer with a cleaning fluid. The atomizer is introduced into the wet cleaning station in an introduction direction. The cleaning nozzle has a rotatable cleaning trunk for dispensing the cleaning fluid. The cleaning device, in some embodiments, also includes a dry cleaning station. A corresponding operating method is also provided.

A rotary cleaning apparatus for underwater cleaning including a housing, a battery, a motor and a flexible hub system. The flexible hub system includes a toroidal brush system coupled to a circular centrifugal pump assembly. The flexible hub system includes a flexible hub allowing the flexible hub system to bend out of plane. When the flexible hub system is rotated underwater at a curved surface, the brush system cleans the surface while the suction of the centrifugal pump assembly flexes the flexible hub system to evenly contact the surface.

A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

Nanobrushes, methods of forming nanobrushes, and methods of altering material with a nanobrush are disclosed herein. A nanobrush may include a substrate having a surface and a plurality of bristles deposited on at least one portion of the surface. The plurality of bristles may be arranged into a plurality of bunches. Each of the plurality of bunches may be spaced from an adjacent bunch at a bunch interval equal to or less than about 100 m.

A cleaning drying processing unit includes a lower spin chuck, a splash prevention cup, and a storage member. The splash prevention cup is provided to surround the lower spin chuck, and has an annular opening that can be opposite to an outer peripheral end of a substrate rotated by the lower spin chuck. A lower portion of the splash prevention cup is stored in the storage member. Cleaning and drying processing using a cleaning liquid are performed on the substrate rotated by the lower spin chuck. At this time, the splash prevention cup is supported such that the annular opening is opposite to the outer peripheral end of the substrate. Gas in a space opposite to the annular opening is sucked from the annular opening through a first annular space of the splash prevention cup and a second annular space in the storage member.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

A propeller assembly to facilitate the cleaning of aquaculture nets. The propeller assembly has a centrally disposed hub with a plurality of aluminum alloy blades extending outwardly to a perimeter ring. A plurality of triangular shaped rigid knuckles is coupled to the perimeter ring. A blade spacer is attached to a leading edge of each blade, the blade spacer constructed of a wear resistant material. In operation, rotation of the blades provides thrust for positioning the knuckles against an aquaculture net, whereby the knuckles remove fouling from the aquaculture net by violently shaking the aquaculture net. The blade spacer positions the propeller assembly a predetermined distance from the aquaculture net to protect the leading edge by distance and/or use of a wear resistant material.