The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.

A dry cleaning device adapted to clean a container component of a container of a semiconductor manufacturing process and adapted to clean the container component by carbon dioxide snowflakes. The dry cleaning device can first inspect the container component before and after cleaning, clean the container component by carbon dioxide snowflakes according to a predetermined cleaning working set, and forwards the container component to a next workstation once the cleaning of the container component is complete. The dry cleaning device is adapted to clean a container of a semiconductor manufacturing process in a fast and effective manner without involving any liquid solvents.

A dry cleaning device adapted to clean a container component of a container of a semiconductor manufacturing process and adapted to clean the container component by carbon dioxide snowflakes. The dry cleaning device can first inspect the container component before and after cleaning, clean the container component by carbon dioxide snowflakes according to a predetermined cleaning working set, and forwards the container component to a next workstation once the cleaning of the container component is complete. The dry cleaning device is adapted to clean a container of a semiconductor manufacturing process in a fast and effective manner without involving any liquid solvents.

An agricultural seed box washing device and method includes a modular enclosure having a washing area having a stationary first spray array and a second spray array movable transverse to the path of travel of the seed box for washing all six geometric sides of the seed box. The device includes a two-directional conveyor that allows the seed box to cycle back and further through the first spray array for multiple passes through the spray arrays.

An agricultural seed box washing device and method includes a modular enclosure having a washing area having a stationary first spray array and a second spray array movable transverse to the path of travel of the seed box for washing all six geometric sides of the seed box. The device includes a two-directional conveyor that allows the seed box to cycle back and further through the first spray array for multiple passes through the spray arrays.

The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.

The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.

According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container. The cleaning chamber includes: a chamber that accommodates a shell of the wafer storage container, and capable of being opened and closed by an opening/closing lid via a hinge; a door holder that holds the door; a cleaning nozzle that supplies a cleaning liquid to the shell and the door; a rotation mechanism that rotates the shell and the door; a circular frame that surrounds an outside of the door and has a height that covers a part of the thickness of the door; and an inclined cover that is provided to be inclined such that an end opposite the hinge is the lowest and is higher toward the circular frame, and guides the cleaning liquid supplied to the door and scattered thereon.

According to one embodiment of the present disclosure, a wafer storage container cleaning apparatus includes a cleaning chamber that cleans a wafer storage container. The cleaning chamber includes: a chamber that accommodates a shell of the wafer storage container, and capable of being opened and closed by an opening/closing lid via a hinge; a door holder that holds the door; a cleaning nozzle that supplies a cleaning liquid to the shell and the door; a rotation mechanism that rotates the shell and the door; a circular frame that surrounds an outside of the door and has a height that covers a part of the thickness of the door; and an inclined cover that is provided to be inclined such that an end opposite the hinge is the lowest and is higher toward the circular frame, and guides the cleaning liquid supplied to the door and scattered thereon.

Cleaning tools for cleaning the pull cable of an ingot puller apparatus and methods for cleaning the pull cable are disclosed. The cleaning tool includes a chamber for receiving the pull cable. Pressurized fluid is discharged through one or more nozzles to detach debris from the pull cable. The fluid and debris are collected in an exhaust plenum of the cleaning tool and are expelled through an exhaust tube. The cleaning tool includes one or more guides that guide the cleaning tool in an upper segment of the ingot puller apparatus.