Patent classifications
B21D26/045
METHOD AND APPARATUS FOR SIMULTANEOUS HOT FORMATION OF HOLLOW COMPONENT
A method of hot forming a pair of hollow components. The method involves heating a die stack comprising a first die, an intermediate die and a second die, in which the first die and the intermediate die form a first die set, and the intermediate die and the second die form a second die set. The die stack is opened and loaded with a first component preform in the first space and a second component preform in the second space. Once loaded, the die stack is closed and a pressurised fluid is then provided via a first conduit to an internal cavity of the first component preform, while a pressurised fluid is also provided via a second conduit to an internal cavity of the second component preform. The die stack is opened and the first component and the second component removed from the respective first space and the second space.
METHOD AND APPARATUS FOR SIMULTANEOUS HOT FORMATION OF HOLLOW COMPONENT
A method of hot forming a pair of hollow components. The method involves heating a die stack comprising a first die, an intermediate die and a second die, in which the first die and the intermediate die form a first die set, and the intermediate die and the second die form a second die set. The die stack is opened and loaded with a first component preform in the first space and a second component preform in the second space. Once loaded, the die stack is closed and a pressurised fluid is then provided via a first conduit to an internal cavity of the first component preform, while a pressurised fluid is also provided via a second conduit to an internal cavity of the second component preform. The die stack is opened and the first component and the second component removed from the respective first space and the second space.