B22F1/147

SILVER PARTICLE DISPERSING SOLUTION, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SILVER PARTICLE DISPERSING SOLUTION

There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (D.sub.SEM) of 0.15 to 0.5 m, and the ratio (D.sub.50/D.sub.SEM) of a particle diameter (D.sub.50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (D.sub.SEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.

SILVER POWDER AND METHOD OF PRODUCING SAME

Provided are a silver powder and a method of producing the same. The method of producing the silver powder includes a first surface smoothing step of causing fine silver particles having internal voids to mechanically collide with one another; a fine powder removal step of dispersing fine silver particles present after the first surface smoothing step using high-pressure airflow while removing fine powder; and a second surface smoothing step of causing fine silver particles present after the fine powder removal step to mechanically collide with one another.

SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
20240189905 · 2024-06-13 ·

A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises at least one silver salt of the formula C.sub.nH.sub.2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160? C.

METHOD OF MAKING A POWDER FOR ADDITIVE MANUFACTURING
20240181526 · 2024-06-06 ·

A method of making a ready-to-print cermet or cemented carbide powder of sintered granules includes the step of sintering the granules in a carburizing atmosphere. Due to the carburizing atmosphere, the granules will have less binder phase on the surface and will not sinter together and will be easy to deagglomerate and the granules will maintain its spherical shape. A powder made according to the method, as well as the use of the powder in an additive manufacturing process is provided.

METHOD OF MAKING A POWDER FOR ADDITIVE MANUFACTURING
20240181526 · 2024-06-06 ·

A method of making a ready-to-print cermet or cemented carbide powder of sintered granules includes the step of sintering the granules in a carburizing atmosphere. Due to the carburizing atmosphere, the granules will have less binder phase on the surface and will not sinter together and will be easy to deagglomerate and the granules will maintain its spherical shape. A powder made according to the method, as well as the use of the powder in an additive manufacturing process is provided.

Silver nanoplate compositions and methods

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density.

Metal colloidal solution and method for producing the same

The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.

BUILD MATERIAL CONTAINERS

There is provided a 3D printing build material container (1). The container (1) comprises a reservoir (3) and a reinforcement structure (4). The reservoir is to hold build material. The reinforcement structure is attached to the reservoir at at least one selected location. The reservoir and reinforcement structure are to permit reconfiguration of the container from a relatively flat configuration to an in-use configuration in which the reservoir is tillable with build material.

Build material container

A build material container for use in 3D printing includes a reservoir to hold build material and a build material outlet structure. The container also includes a throughput structure to allow air to enter into the reservoir through the throughput opening, wherein said throughput opening provides access to build material in and out of the reservoir.

Bonding material and bonded structure

A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.