A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 m and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.

A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 m and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.

A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110 C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280 C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

Obtained are a silver powder and a mixed powder that can achieve low-resistance electrode wiring when printing wires, and a conductive paste using these powders. The silver powder includes, as 20% or more and less than 95% of all particles, silver particles whose main region of the silver particle upper surface is the (111) plane or a plane close to the (111) plane. The KAM value of the silver particles is 0.4 or more and 1.0 or less.

The purpose of the present invention is to provide a method for modifying nickel microparticles weight loss of which occurs due to heat treatment such as burning and a method for producing nickel microparticles comprising the modification method.

Provided is a method for modifying nickel microparticles comprising a step of making an acid and/or hydrogen peroxide act on nickel microparticles weight loss of which occurs due to heat treatment such as burning and a method for producing nickel microparticles comprising the modification method. The step of making an acid and/or hydrogen peroxide act reduces a rate of weight loss due to heat treatment of the nickel microparticles, nitric acid or a mixture of acids that include nitric acid is preferably used as the acid, and the nickel microparticles and acid and/or hydrogen peroxide are preferably made to act in a ketonic solvent.

The purpose of the present invention is to provide a method for modifying nickel microparticles weight loss of which occurs due to heat treatment such as burning and a method for producing nickel microparticles comprising the modification method.

Provided is a method for modifying nickel microparticles comprising a step of making an acid and/or hydrogen peroxide act on nickel microparticles weight loss of which occurs due to heat treatment such as burning and a method for producing nickel microparticles comprising the modification method. The step of making an acid and/or hydrogen peroxide act reduces a rate of weight loss due to heat treatment of the nickel microparticles, nitric acid or a mixture of acids that include nitric acid is preferably used as the acid, and the nickel microparticles and acid and/or hydrogen peroxide are preferably made to act in a ketonic solvent.

The present invention provides a magnetic core part by which failures such as cracks do not occur even if the magnetic core part contains 90% by mass or more of an amorphous metal powder. The magnetic core part is formed by thermoset molding at least one magnetic powder selected from an amorphous metal powder alone and an amorphous metal powder coated with an insulating material, and a thermosetting binder resin. The magnetic core part contains the magnetic powder in an amount of 90% by mass or more and 99% by mass or less with respect to the total amount of the magnetic powder and the thermosetting binder resin.

The present invention provides a magnetic core part by which failures such as cracks do not occur even if the magnetic core part contains 90% by mass or more of an amorphous metal powder. The magnetic core part is formed by thermoset molding at least one magnetic powder selected from an amorphous metal powder alone and an amorphous metal powder coated with an insulating material, and a thermosetting binder resin. The magnetic core part contains the magnetic powder in an amount of 90% by mass or more and 99% by mass or less with respect to the total amount of the magnetic powder and the thermosetting binder resin.

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density.

A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100 C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.