A sintered bearing 1 is formed by sintering a raw material powder containing aluminum fluoride. The sintered bearing 1 has a structure obtained by sintering an aluminum-copper alloy and contains 3 to 13 mass % aluminum and 0.05 to 0.6 mass % phosphorus, copper as a main component of the remainder, and inevitable impurities. The sintered bearing 1 is manufactured by performing sintering in a closed space 23, and by, under the assumption that all aluminum fluoride contained in the raw material powder is gasified in the closed space 23, controlling the concentration of the aluminum fluoride gas to be 5 ppm or more, thus performing the sintering.

A sintered bearing 1 is formed by sintering a raw material powder containing aluminum fluoride. The sintered bearing 1 has a structure obtained by sintering an aluminum-copper alloy and contains 3 to 13 mass % aluminum and 0.05 to 0.6 mass % phosphorus, copper as a main component of the remainder, and inevitable impurities. The sintered bearing 1 is manufactured by performing sintering in a closed space 23, and by, under the assumption that all aluminum fluoride contained in the raw material powder is gasified in the closed space 23, controlling the concentration of the aluminum fluoride gas to be 5 ppm or more, thus performing the sintering.

A method for manufacturing a porous metal body according to the present invention includes: a surface oxidizing step of heating a titanium-containing powder in an atmosphere containing oxygen at a temperature of 250° C. or more for 30 minutes or more to provide a surface-oxidized powder; and a sintering step of depositing the surface-oxidized powder in a dry process, and sintering the surface-oxidized powder by heating it in a reduced pressure atmosphere or an inert atmosphere at a temperature of 950° C. or more.

A method for manufacturing a porous metal body according to the present invention includes: a surface oxidizing step of heating a titanium-containing powder in an atmosphere containing oxygen at a temperature of 250° C. or more for 30 minutes or more to provide a surface-oxidized powder; and a sintering step of depositing the surface-oxidized powder in a dry process, and sintering the surface-oxidized powder by heating it in a reduced pressure atmosphere or an inert atmosphere at a temperature of 950° C. or more.

A method is provided in which a lower box comprising a base, walls that surround the base and an open side, and an upper box comprising a cover, walls that surround the cover and an open side are provided. One or more objects are arranged on the base of the lower box. The object(s) are covered with the upper box such that the open side of the upper is oriented towards the base of the box, the walls of the upper box are arranged on the base of the lower box and a gap is formed between the walls of the upper box and the walls of the lower box. A powder material is introduced into the gap in order to form an assembly having an interior. The powder material provides a mechanical obstacle to gas exchange between the interior and the environment. This assembly is then heat treated.

Disclosed is a coating material for coating a surface of a kiln for preparing an active material, the coating material being represented by the following Formula 1:

Ni.sub.aX.sub.z  (1) wherein an equation of a+z=1 is satisfied, with the proviso that 0.2≤a<1.0 and 0<z≤0.8 are satisfied, and X is at least one element selected from the group consisting of W, Cr, Co, Fe, Cu, Na, Al, Mg, Si, Zn, K, Ti, Mo, N, B, P, C, Ta, Nb, O, Mn, Sn, Ag and Zr, or an alloy or compound of two or more elements selected therefrom.

Disclosed is a coating material for coating a surface of a kiln for preparing an active material, the coating material being represented by the following Formula 1:

Ni.sub.aX.sub.z  (1) wherein an equation of a+z=1 is satisfied, with the proviso that 0.2≤a<1.0 and 0<z≤0.8 are satisfied, and X is at least one element selected from the group consisting of W, Cr, Co, Fe, Cu, Na, Al, Mg, Si, Zn, K, Ti, Mo, N, B, P, C, Ta, Nb, O, Mn, Sn, Ag and Zr, or an alloy or compound of two or more elements selected therefrom.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

A mixture for making a multilayer inductor, wherein the mixture comprises a first magnetic powder, a second magnetic powder, and a glass material, wherein each of the first magnetic powder and the second magnetic powder comprises an amorphous or nanocrystalline magnetic powder, wherein a softening point temperature of the glass material is in a range of 300°˜430° C.

A mixture for making a multilayer inductor, wherein the mixture comprises a first magnetic powder, a second magnetic powder, and a glass material, wherein each of the first magnetic powder and the second magnetic powder comprises an amorphous or nanocrystalline magnetic powder, wherein a softening point temperature of the glass material is in a range of 300°˜430° C.