A susceptor for use in a heat-not-burn device, and a method of manufacturing thereof, using metal pieces incorporated together into a single unitary piece using a variety of techniques, such as compacting, heat and pressure, sintering, weaving, extruding, and the like, such that the susceptor is susceptible to degradation after use.

The present document discloses a tool or tool part for use in a process of molding a product from a pulp slurry. The tool or tool part comprises a self-supporting tool wall portion having a product face, for contacting the product, and a back face on the other side of the wall relative to the product face. The tool wall portion presenting pores, which are provided by a plurality of channels extending through the tool wall portion, from the product face to the back face. The channels are straight or curved with no more than one point of inflection.

The present disclosure relates to a process of manufacturing an article comprising at least one body of a cemented carbide and at least one body of a metal alloy or at least one body of a metal matrix composite and to a product manufactured thereof and wherein the article also comprises an interlayer between the at least one body of a cemented carbide and at least one body of a metal alloy or at least one body of a metal matrix composite in order to prevent deleterious interface phases from forming.

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

A heat exchanger is characterized by having two or more fluid flow circuits, each formed by multiple small cross-section “micro-tubes” contained within a surrounding metal structure, or “metal matrix.” Its function is to efficiently transfer heat from one fluid to another in a highly compact assembly. Most any metal or metal alloy can be considered for the micro-tubes. The micro-tubes, while typically arranged in alternating layers of alternating flow circuits, may be organized in any number of arrangements including co-linear and at cross angles to provide for co-flow, counter flow and cross flow. The metal matrix, is provided in one embodiment by a metal or metal alloy powder consolidated in a hot isostatic pressing (HIP) process. This process also joins the tubes together and to the matrix itself, producing a monolithic structure.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a braze region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the braze region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the solidus temperature of the braze material. A braze precursor material is also provided.

A heat exchanger is characterized by having two or more fluid flow circuits, each formed by multiple small cross-section “micro-tubes” contained within a surrounding metal structure, or “metal matrix.” Its function is to efficiently transfer heat from one fluid to another in a highly compact assembly. Most any metal or metal alloy can be considered for the micro-tubes. The micro-tubes, while typically arranged in alternating layers of alternating flow circuits, may be organized in any number of arrangements including co-linear and at cross angles to provide for co-flow, counter flow and cross flow. The metal matrix, is provided in one embodiment by a metal or metal alloy powder consolidated in a hot isostatic pressing (HIP) process. This process also joins the tubes together and to the matrix itself, producing a monolithic structure.