An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor.

An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

A process for manufacturing a PTC heating element that includes at least one PTC component (20) and a carrier (14, 16) permanently connected to the PTC component on at least one side (24, 26) of thereof The process includes applying electrically conductive sintered material (28, 30, 36, 38) on the one side of the PTC component, which side is to be permanently connected to a carrier. Subsequently, a contact of the PTC component is established with at least one carrier such that sintered material, which was applied between the PTC component and the carrier and is intended for establishing a connection between the at least one PTC component and the at least one carrier, is positioned. The sintered material, which material has been positioned between the PTC component and the carrier, is sintered by heating or/and by applying pressure.

This application relates to a method of manufacturing a cooling pipe for a powertrain of an electric vehicle. The method may include preparing a powdered composite material by ball-milling aluminum alloy particles and carbon nanotube particles. The method may also include preparing a multilayer billet containing the powdered composite material and comprising a core layer and two or more shell layers surrounding the core layer. The method may further include extruding the multilayer billet to produce a pipe-shaped extrusion. The core layer is made of the powdered composite material or an aluminum alloy, the outermost shell layer of the two or more shell layers is made of an aluminum alloy, and the remaining shell layers are made of an aluminum alloy. This application also relates to a cooling pipe manufactured by the method, an electric vehicle motor and an electric vehicle battery pack casing including the cooling pipe.

This application relates to a method of manufacturing a cooling pipe for a powertrain of an electric vehicle. The method may include preparing a powdered composite material by ball-milling aluminum alloy particles and carbon nanotube particles. The method may also include preparing a multilayer billet containing the powdered composite material and comprising a core layer and two or more shell layers surrounding the core layer. The method may further include extruding the multilayer billet to produce a pipe-shaped extrusion. The core layer is made of the powdered composite material or an aluminum alloy, the outermost shell layer of the two or more shell layers is made of an aluminum alloy, and the remaining shell layers are made of an aluminum alloy. This application also relates to a cooling pipe manufactured by the method, an electric vehicle motor and an electric vehicle battery pack casing including the cooling pipe.

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled to the current source; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The first and second major surfaces may be positioned adjacent to each other to define a joint region. The controller may be configured to cause the current source to output an alternating current that passes from the first component, through at least a portion of the metal or alloy powder, into the second component. The frequency of the alternating current may be configured to cause standing electromagnetic waves within at least a portion of the particles of the metal or alloy powder.

A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled to the current source; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The first and second major surfaces may be positioned adjacent to each other to define a joint region. The controller may be configured to cause the current source to output an alternating current that passes from the first component, through at least a portion of the metal or alloy powder, into the second component. The frequency of the alternating current may be configured to cause standing electromagnetic waves within at least a portion of the particles of the metal or alloy powder.

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.

A method and apparatus for resistive heating usable in composite-based additive manufacturing is disclosed. The method includes providing a prepared stack of substrate sheets, placing the stack between electrode assemblies of a compression device, applying a current to thereby heat the stack to a final temperature to liquefy applied powder, compressing the stack to a final height, cooling the stack, and removing the cooled, compressed stack from the compression device. The apparatus comprises at least two plates, a power supply for providing current, a first electrode assembly and a second electrode assembly.

An additive manufacturing system includes an additive manufacturing tool configured to supply a plurality of droplets to a part, a temperature control device configured to control a temperature of the part, and a controller configured to control the composition, formation, and application of each droplet to the plurality of droplets to the part independent from control of the temperature of the part via the temperature control device. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material.