An additive manufacturing system includes an additive manufacturing tool configured to supply a plurality of droplets to a part, a temperature control device configured to control a temperature of the part, and a controller configured to control the composition, formation, and application of each droplet to the plurality of droplets to the part independent from control of the temperature of the part via the temperature control device. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body.

An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

A method for producing a copper-infiltrated valve seat ring and a valve seat ring are disclosed. The method includes introducing a copper powder and a functional material powder mixture into a joint cavity, simultaneously forming the copper powder and the functional material powder mixture into a green body comprising a functional section and a copper section in the joint cavity by the mold element, and sintering the green body formed in step b) to produce the valve seat ring where the copper section liquefies during the sintering and infiltrates pores present in the functional section.

A method for producing a copper-infiltrated valve seat ring and a valve seat ring are disclosed. The method includes introducing a copper powder and a functional material powder mixture into a joint cavity, simultaneously forming the copper powder and the functional material powder mixture into a green body comprising a functional section and a copper section in the joint cavity by the mold element, and sintering the green body formed in step b) to produce the valve seat ring where the copper section liquefies during the sintering and infiltrates pores present in the functional section.

A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a ceramic tile, and assembling a precursor assembly of a direct bonded copper (DBC) substrate by coupling a first leadframe on the sinter precursor material layer on the first surface of the ceramic tile and a second leadframe on the second surface of the sinter precursor material layer on a second surface of the ceramic tile such that the ceramic tile is disposed between the first leadframe and the second leadframe. The method further includes sinter bonding the first leadframe and the second leadframe to the ceramic tile to form a sinter bonded DBC substrate.

The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 μm. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.