A mounting structure is used, which includes: a semiconductor element including an element electrode; a metal member; and a sintered body configured to bond the semiconductor element and the metal member is used, in which the sintered body contains a first metal and a second metal solid-dissolved in the first metal, the second metal is a metal having a diffusion coefficient in the first metal larger than a self-diffusion coefficient of the first metal, and a content ratio of the second metal relative to a total mass of the first metal and the second metal in the sintered body is equal to or lower than a solid solution limit of the second metal to the first metal.

This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.

A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.

An electrostatic chuck includes a base plate that is made of a metal; a ceramic plate that is fixed to the base plate and configured to adsorb an object by electrostatic force; and a bonding layer that is provided between the base plate and the ceramic plate to bond the base plate and the ceramic plate to each other. The bonding layer is formed of a composite material including the metal forming the base plate and a ceramic forming the ceramic plate.

An electrostatic chuck includes a base plate that is made of a metal; a ceramic plate that is fixed to the base plate and configured to adsorb an object by electrostatic force; and a bonding layer that is provided between the base plate and the ceramic plate to bond the base plate and the ceramic plate to each other. The bonding layer is formed of a composite material including the metal forming the base plate and a ceramic forming the ceramic plate.

A method of furnace-less brazing of a substrate is provided. The method includes providing a substrate having a brazing region thereon; disposing braze precursor material containing a nickel powder, an aluminum powder, and a platinum group metal powder on the brazing region; and initiating an exothermic reaction of the braze precursor material such that the exothermic reaction produces a braze material that reaches a braze temperature above the liquidus temperature for the braze material. A braze precursor material is also provided.