The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

A tantalum powder, a tantalum powder compact, a tantalum powder sintered body, a tantalum anode, an electrolytic capacitor and a preparation method for tantalum powder. The tantalum powder contains boron element, and the tantalum powder has a specific surface area of greater than or equal to 4 m.sup.2/g; the ratio of the boron content of the tantalum powder to the specific surface area of the tantalum powder is 2˜16; the boron content is measured in weight ppm, and the specific surface area is measured in m.sup.2/g; Powder that can pass through a ρ-mesh screen in the tantalum powder accounts for over 85% of the total weight of the tantalum powder, where ρ=150˜170; and the tantalum powder with high CV has a low leakage current and dielectric loss, and good moldability.

A tantalum powder, a tantalum powder compact, a tantalum powder sintered body, a tantalum anode, an electrolytic capacitor and a preparation method for tantalum powder. The tantalum powder contains boron element, and the tantalum powder has a specific surface area of greater than or equal to 4 m.sup.2/g; the ratio of the boron content of the tantalum powder to the specific surface area of the tantalum powder is 2˜16; the boron content is measured in weight ppm, and the specific surface area is measured in m.sup.2/g; Powder that can pass through a ρ-mesh screen in the tantalum powder accounts for over 85% of the total weight of the tantalum powder, where ρ=150˜170; and the tantalum powder with high CV has a low leakage current and dielectric loss, and good moldability.

A tantalum powder, a tantalum powder compact, a tantalum powder sintered body, a tantalum anode, an electrolytic capacitor and a preparation method for tantalum powder. The tantalum powder contains boron element, and the tantalum powder has a specific surface area of greater than or equal to 4 m.sup.2/g; the ratio of the boron content of the tantalum powder to the specific surface area of the tantalum powder is 2˜16; the boron content is measured in weight ppm, and the specific surface area is measured in m.sup.2/g; Powder that can pass through a ρ-mesh screen in the tantalum powder accounts for over 85% of the total weight of the tantalum powder, where ρ=150˜170; and the tantalum powder with high CV has a low leakage current and dielectric loss, and good moldability.

Processes for producing copper granules on a surface of a reducing metal. The process can include contacting the reducing metal with an aqueous solution comprising a copper(II) salt and a halide. The molar ratio of the halide to the copper(II) in the copper (II) salt can be at least about 3:1. The granular copper can be produced on a surface of the reducing metal, and is optionally removed from the surface of the reducing metal by shaking, washing, and/or brushing, and/or optionally with stirring and/or circulating of the aqeuous solution.

A 3D nanoprinter electron beam lithography module for a lithography system, such as a scanning electron microscope (SEM) or an environmental SEM (ESEM) with a beam blanker and electron beam lithography attachment, but generally applicable to any electron beam lithography capable system. The module is comprised of an in-situ spin-coating stage that is compatible with a cooling-SEM stage, with a spin-coating motor, a spin-coating sample stub, a liquid waste collector cup, a liquid dispensing arm holding a tube bundle that is connected via tubing to micro-syringe pumps or a pressure driven flow controller or pumps connected to fluid reservoirs, an electron beam scan generator control box, electrical feedthroughs, control electronics, and a computing system responsible for controlling the entire module. The dispensing arm can be controlled by a servo motor.

A 3D nanoprinter electron beam lithography module for a lithography system, such as a scanning electron microscope (SEM) or an environmental SEM (ESEM) with a beam blanker and electron beam lithography attachment, but generally applicable to any electron beam lithography capable system. The module is comprised of an in-situ spin-coating stage that is compatible with a cooling-SEM stage, with a spin-coating motor, a spin-coating sample stub, a liquid waste collector cup, a liquid dispensing arm holding a tube bundle that is connected via tubing to micro-syringe pumps or a pressure driven flow controller or pumps connected to fluid reservoirs, an electron beam scan generator control box, electrical feedthroughs, control electronics, and a computing system responsible for controlling the entire module. The dispensing arm can be controlled by a servo motor.

A method of manufacturing a chiral nano-structure having chirality using a magnetic field according to one embodiment of the present disclosure includes a magnetic field forming operation that forms a magnetic field; a particle arranging operation that arranges at least two nanoparticles in the magnetic field; and a magnetic field adjusting operation that adjusts at least one of a magnetic flux density, a magnetization direction, and a spatial range of the magnetic field, in which in the magnetic field adjusting operation, the arrangement of the nanoparticles arranged in the magnetic field is aligned to correspond to a structure of the magnetic field, and the entire structure is formed as a nano-structure having chirality.

A method of manufacturing a chiral nano-structure having chirality using a magnetic field according to one embodiment of the present disclosure includes a magnetic field forming operation that forms a magnetic field; a particle arranging operation that arranges at least two nanoparticles in the magnetic field; and a magnetic field adjusting operation that adjusts at least one of a magnetic flux density, a magnetization direction, and a spatial range of the magnetic field, in which in the magnetic field adjusting operation, the arrangement of the nanoparticles arranged in the magnetic field is aligned to correspond to a structure of the magnetic field, and the entire structure is formed as a nano-structure having chirality.