Patent classifications
B23K3/0475
Inductive heater for area array rework system and soldering handpieces
An induction heater having inner and outer chamber cylinders connected in an air tight manner to a base and cover with an inner chamber being formed within the inner chamber cylinder and an outer chamber being formed between the inner and outer chamber cylinders, a heat exchange core disposed in the inner chamber, and an induction heater coil disposed in the outer chamber extending around the inner chamber cylinder. A flow path is provided from a cool air inlet in the base, along the outer chamber, into the inner chamber and through the inner chamber and core to a heated air outlet in the base in a counterflow direction relative to the flow along the outer chamber. The heater is especially well suited for use in convective soldering and rework apparatus.
DEVICE FOR SOLDERING THE INTERCONNECTIONS OF PHOTOVOLTAIC PANELS WITH AN INDUCTOR AND LONGITUDINALLY ARRANGED INSERT
The present disclosure concerns a device for soldering the interconnections of photovoltaic panels. The device includes: an inductor, which in turn includes a filament, which substantially develops so as to form two parallel branches: a first branch and a second branch, and an insert, which has a longitudinal development, which is at least partly surrounded longitudinally by said filament and is interposed between said two branches.
Apparatus for brazing radial bearings and related methods
Apparatuses and methods are provided for manufacturing bearing assemblies. In accordance with one embodiment, a fixture is provided for use in brazing bearing elements to a bearing ring. The fixture comprises a substantially annular body and at least one or more force-applying mechanism associated with the annular body. The force applying mechanisms include a push rod disposed within a channel that is formed in the annular body, the push rod being displaceable within the channel. A biasing member is configured to bias the push rod in a radial direction relative to the annular body. In one embodiment, a plurality of force-applying mechanisms are circumferentially spaced about the substantially annular body. In one embodiment, the push rods extend radially inwardly from a peripheral surface of the body, while in another embodiment the push rods extend radially outwardly from peripheral surface of the body.
Non-Explosive Release Mechanism Based on Electromagnetic Induction Melting
The present invention relates to a release system (1, 2, 3, 4, 5), that includes a segmented structural element (10) comprising: a first segment (10a) designed to be coupled to a first structure, a second segment (10b) designed to be coupled to a second structure, and a solder joint (11) joining respective ends of said first (10a) and second (10b) segments, thus holding down the first and second structures with respect to one another; wherein said solder joint (11) is electromagnetically heatable and includes a solder alloy having a predefined melting temperature. The release system (1, 2, 3, 4, 5) is characterized by further including magnetic field generating means (13, PW1, PW2, PW3, PW4, PW5) configured to, upon reception of a release command, generate a time-varying magnetic field through the solder joint (11) such that to cause heating thereof up to the predefined melting temperature of the solder alloy, thereby causing melting of said solder alloy; whereby separation of the first (10a) and second (10b) segments is caused, thus enabling release of the first and second structures from one another.
Method and apparatus for forming interface between coaxial cable and connector
A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the solder element is positioned within a vacuum chamber; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with a mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.
JOINING DEVICE AND METHOD FOR PRODUCING AN EXHAUST GAS SYSTEM
A joining device for producing an exhaust gas system for an internal combustion engine comprises a device base, a frame, and at least two joining units that can be operated simultaneously are fastened to the frame. The frame extends essentially vertically starting from the device base. In a method for producing the exhaust gas system, at least one joining unit of a joining device is oriented to a geometry of the exhaust gas system that is to be produced, at least three components or assemblies of the exhaust gas system are positioned in the joining device, and the components or assemblies are simultaneously connected.
Induction heating device, joining method, joined component and rotary electric machine including the same
A joined component comprises a first heated body, a second heated body, a brazing material, a first heated portion and a second heated portion. The first body comprises an insertion opening and an inserted portion coupled with the insertion opening. The second body comprises an insertion portion inserted into the inserted portion through the insertion opening. The first heated portion is provided at a first position including at least a part of the inserted portion and at least a part of the insertion portion. The second heated portion is provided at a second position separate from the insertion portion where a ratio L/D satisfies being 0.4 or more and 0.8 or less, where L is a length from the insertion opening to the second portion and D is an outer diameter of the second heated body.
Process for fabricating inductive heated solder cartridge
A method or process of fabricating a solder cartridge and solder cartridge made according to the process is disclosed. The solder cartridge made according to the process provides a self-temperature regulating solder tip for an inductive current soldering station having improved heater quality and stability with reduced manufacturing costs.
HEATING AND COOLING DEVICE
A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.
INDUCTION-HEATED SOLDERING AUTOMATION EQUIPMENT
The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.