An induction heater having inner and outer chamber cylinders connected in an air tight manner to a base and cover with an inner chamber being formed within the inner chamber cylinder and an outer chamber being formed between the inner and outer chamber cylinders, a heat exchange core disposed in the inner chamber, and an induction heater coil disposed in the outer chamber extending around the inner chamber cylinder. A flow path is provided from a cool air inlet in the base, along the outer chamber, into the inner chamber and through the inner chamber and core to a heated air outlet in the base in a counterflow direction relative to the flow along the outer chamber. The heater is especially well suited for use in convective soldering and rework apparatus.

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.

A method for manufacturing an induction coil assembly is disclosed. The method includes preparing a Computer Aided Design (CAD) model of an induction coil. The method further includes communicating the CAD model of the induction coil with a Three Dimensional (3D) printing machine The method further includes operating the 3D printing machine to deposit a plurality of layers of copper material one above other to manufacture the induction coil corresponding to the CAD model. The method further includes forming at least one hole in an annular member of the induction coil to receive a coolant and at least one hole in a first leg and a second leg to discharge the coolant.

A system for assembling a vehicular window assembly includes a heating device that, when electrically operated, heats an electrical connector disposed at a glass panel of a vehicular window assembly to heat and melt solder disposed between the electrical connector and an electrically conductive trace established at the glass panel to form a solder joint providing electrically-conductive connection between the electrical connector and the electrically conductive trace established at the glass panel. A temperature sensor captures sensor data indicative of a temperature of the electrical connector and the solder. The system, based on processing at an electronic control unit (ECU) of the captured sensor data, adjusts electrical operation of the heating device to adjust the temperature of the electrical connector and the solder during the soldering process that forms the solder joint.

Apparatuses and methods are provided for manufacturing bearing assemblies. In accordance with one embodiment, a fixture is provided for use in brazing bearing elements to a bearing ring. The fixture comprises a substantially annular body and at least one or more force-applying mechanism associated with the annular body. The force applying mechanisms include a push rod disposed within a channel that is formed in the annular body, the push rod being displaceable within the channel. A biasing member is configured to bias the push rod in a radial direction relative to the annular body. In one embodiment, a plurality of force-applying mechanisms are circumferentially spaced about the substantially annular body. In one embodiment, the push rods extend radially inwardly from a peripheral surface of the body, while in another embodiment the push rods extend radially outwardly from peripheral surface of the body.

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.

A brazing method connects an assembly made up of a pipe, a component provided with an opening, and a compensation element. The compensation element includes a support section and an insertion section that is arranged between an end of the pipe and the opening of the component. An inside diameter of the compensation element is smaller than a diameter of the opening in the component. The insertion section is inserted into the end of the pipe, and the support section is located between the pipe and the component and rests on the component at the edge of the opening. The compensation element, the pipe, and the component are heated, preferably inductively, in a region of the compensation element to a temperature above the melting temperature of brazing material that is present in the region of the brazing points.

A reflow flip chip bonding tool apparatus is provided. The bonding tool apparatus includes a heater configured to heat air and a bonding tool body disposed on an upper surface of the chip, wherein a movement path is formed between a lower surface of the bonding tool body and the upper surface of the chip, the air heated by the heater heats the chip through non-contact convection heat transfer while flowing through the movement path, and a solder disposed between the lower surface of the chip and an electrode pad of the substrate is melted.

A brazing apparatus to join a first component and a second component includes a heating element configured to melt a ring located at a joint between the first component and the second component, and a probe configured to contact the ring. A position of the probe is biased toward the ring. The probe is installed at a probe support. The probe is movable along a probe central axis relative to the probe support. A sensor is operably connected to the probe and is configured to determine movement of the probe along the probe central axis. The movement of the probe is indicative of melting of the ring.

An arrangement comprises a process chamber, an inductor chamber with one or more inductors arranged therein, a supply tube configured to carry process gas from a gas source to the process chamber, an outlet tube configured to carry process gas away from the process chamber, a first bypass tube arranged between the supply tube and the inductor chamber and configured to carry process gas from the supply tube to the inductor chamber, and a second bypass tube arranged between the inductor chamber and the outlet tube and configured to carry process gas from the inductor chamber to the outlet tube. A wall separates the inductor chamber from the process chamber.