Patent classifications
B23K3/063
BONDING STRUCTURE OF DISSIMILAR METAL MEMBERS AND PRECURSOR THEREOF
A bonding structure of dissimilar metal members, including a first metal member, a second metal member, and a brazing filler metal, wherein the brazing filler metal bonds a bonding end surface of the first metal member and a bonding end surface of the second metal member, and any one or both of the following conditions (1) and (2) are satisfied: (1) at least a part of the bonding end surface of the first metal member in a thickness direction of the first metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the first metal member, and (2) at least a part of the bonding end surface of the second metal member in a thickness direction of the second metal member is an inclined surface inclined with respect to a plane perpendicular to the thickness direction of the second metal member.
WIRE BONDING APPARATUS
To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.
Soldering apparatus
A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.
Apparatus, non-transitory computer readable medium, and method for soldering
A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
Solder processing device
A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Wh1) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.
SOLDER PROCESSING DEVICE
A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.
APPARATUS AND METHOD FOR AUTOMATED SOLDERING PROCESS
In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.
Soldering apparatus and method
A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.
ELECTRIC HEATING DEVICE
An electric heating device includes a body and a heating head connected to the body. The heating head includes an electric heating wire and a heat storage member. The electric heating wire includes a first section and a second section connected to the first section. The first section is made of pure nickel. The second section is made of ferrochrome. The heat storage member is mounted around an outer radial periphery of the second section. The heat storage member is made of porcelain clay. The electric heating wire is connected by sections of three different materials so that the heating head can be raised to a very high temperature with extremely high heat generation efficiency, and the electric heating device is not easily damaged by high temperature.
Welding System
A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.