Systems and methods are provided for wire processing. In certain examples, a wire processing system may be disclosed. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.

A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.

A solar cell module and a method and a device for repairing the solar cell module are disclosed. The method for repairing a defective solar cell of the solar cell module includes cutting a plurality of wiring members electrically connecting the defective solar cell to a normal solar cell at a back surface of the solar cell module and forming previous wiring members of the normal solar cell, so that a cutting position of the plurality of wiring members is not seen from a front surface of the solar cell module, positioning a connection bar at the back surface of the solar cell module such that the connection bar crosses the cut previous wiring members of the normal solar cell and replaceable wiring members of a new solar cell, and electrically connecting the previous wiring members, the replaceable wiring members, and the connection bar.

A brazing system (1) for manufacturing an armored superconductor wire (10, 10a) comprises: a first feeder (5) of a superconductor wire (11), a second feeder (6) of a conductor wire (12), a layer (13) of brazing alloy being applied to a first face (12a) of the conductor wire (12), an aligning device (8) for approaching the superconductor wire (11) to said first face (12a), a furnace for melting the brazing alloy layer (13), a collimator (15), comprising: at least one first plurality of rolls (17) rotatable about respective first rotation axes (Y) orthogonal to said axial direction (X) to compress said assembly in direction orthogonal to said first face (12a), at least one second plurality of rolls (18) rotatable about respective second rotation axes (Z) orthogonal to the axial direction (X) and to the first rotation axes (Y) to compress the sides of the assembly, cooling means (25) downstream of the rolls (17, 18) to solidify the brazing alloy layer (13).

A worktable for a soldering iron a base plate with two fixed plates perpendicularly extending from the top thereof. At least one of the two fixed plates has a first locking member and a first notch. A movable plate is movably located between the two fixed plates for securing a larger part. The movable plate has a second notch for securing small part. An adjustment member rotatably extends through the two fixed plates and the movable plate to adjust a fitting distance for the solder parts. An axle is connected across the two fixed plates and carries a soldering wire roll thereto. A soldering iron seat is located beside one of the two fixed plates for receiving the soldering iron therein.

A solder supply unit able to be attached to a solder cutting unit and is able to detached is provided. The solder supply unit includes a reel holder rotatably holding a reel of a tape-like solder material; and a guidance member guiding the tape-like solder material wound around the reel when the tape-like solder material is fed out. The guidance member includes an extension portion guiding a lower surface of the tape-like solder material along a feeding direction of the tape-like solider material; and an opening penetrating the extension portion in an up-down direction and extending toward an upstream side in the feeding direction from a downstream end of the guidance member. The opening is formed in the predetermined length in the feeding direction so that a holding member, which holds the tape-like solder material together with another holding member, is able to move in the feeding direction.

Disclosed techniques compensate for variable forces applied to a brazing head in order to more accurately maintain application of a desired lateral force by a brazing wire, filling wire or tracking finger extending from the brazing head to a component. Orientation of the brazing head is determined relative to gravity and the angle of a movable arm of the brazing head relative to a support body of the brazing head. A lateral force value measured by a lateral force sensor is adjustable based on the determined orientation of the brazing head and the determined angle of the arm relative to the support body in order to provide a corrected or adjusted lateral force value. At least a portion of the brazing head is repositioned relative to the component if the corrected lateral force value deviates from a predetermined value.

A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.

A soldering wire dispensing apparatus is provided and comprises a support frame with a motor is mounted therein. A motor axle extends from the motor and rotates upon activation of the motor. A dispenser spool is mounted within the support frame with a predetermined amount of solder wire. A dispensing axle extends from the dispenser spool. A connecting belt links the motor axle to the dispensing axle to rotate the dispensing axle with rotation of the motor axle. A flexible wire nozzle is positioned in and extends from the support frame. An adjustment housing is mounted to the support frame. An upright bar is slidably mounted within the adjustment housing. A lever is connected to the upright bar and extends through the adjustment housing. A connecting wire extends between the second end of the wire nozzle and the upright bar. Upon moving the lever downward, the connecting wire nozzle bends nozzle to a predetermined angle relative to the adjustment housing.