A brazing assembly for a roof laser-brazing system includes: i) a brazing bracket configured to be mounted to a brazing robot in a brazing section; ii) a laser head mounted to the brazing bracket and configured to emit a laser beam to irradiate a bonding portion of a side panel and a bonding portion of a roof panel; and iii) a wire feeder mounted to the brazing bracket and configured to supply a filler wire to a focal position of the laser beam.

An alignment tool for a solder machine includes a base portion, a bracket and a solder wire alignment portion. Each portion is moveable with respect to the other portions. The base portion includes a laser alignment hole provided on a slope that extends from the base portion. The laser alignment hole is used to align the alignment tool to a laser of the solder machine. A solder wire feeder alignment slot of the solder wire alignment portion is used to align the bracket and the solder wire alignment portion with a solder wire feeder of the solder machine. When each portion of the alignment tool is in a desired position, fasteners of the alignment tool are tightened to secure each portion in the desired position. The alignment tool mirrors a correct alignment between the laser and the solder wire feeder and is usable for subsequent solder machine alignment processes.

Welding-apparatus configured to weld base-material through wire-material melted by welding-laser, includes: laser-applicator configured to apply welding-laser to welding-area; wire-feeder configured to feed wire-material to welding-area; detector provided on wire-feeder and configured to detect feed-amount of wire-material or reaction-force from wire-material; moving-unit configured to move welding-area or wire-material; controller configured to respectively control laser-applicator, wire-feeder, and moving-unit. Controller is configured to perform: controlling wire-feeder to stop feeding wire-material to welding-area; then controlling laser-applicator to stop applying welding-laser to welding-area; then controlling moving-unit so that welding-area and wire-material are separated from each other; determining whether wire-material has been welded to base-material based on feed-amount of wire-material or reaction-force from wire-material detected by detector; and controlling laser-applicator to apply cutting-laser when it is determined that wire-material has been welded to base-material.

A solder supply unit able to be attached to a solder cutting unit and is able to detached is provided. The solder supply unit includes a reel holder rotatably holding a reel of a tape-like solder material; and a guidance member guiding the tape-like solder material wound around the reel when the tape-like solder material is fed out. The guidance member includes an extension portion guiding a lower surface of the tape-like solder material along a feeding direction of the tape-like solider material; and an opening penetrating the extension portion in an up-down direction and extending toward an upstream side in the feeding direction from a downstream end of the guidance member. The opening is formed in the predetermined length in the feeding direction so that a holding member, which holds the tape-like solder material together with another holding member, is able to move in the feeding direction.