A wire clamping system for fully automatic wire bonding machine comprises a base, a wire clamping support, a wire clamping assembly, a driving mechanism and an elastic assembly. The wire clamping assembly can move relative to the capillary, so that when the wire clamping system completes the second bond, the metal wire at the end of the capillary may directly extend out of the capillary by the independent movement of the wire clamping assembly and a length thereof can be effectively controlled, in order to form a metal ball in the next first bond. Furthermore, when the wire clamping system completes the second bond, the wire clamping assembly is in a clamping state, which avoids wires flying, even though the second bond is not firmly connected or the machine vibrates.

A capillary transport device is capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. The capillary transport device includes: a first tube for transporting a capillary; an ultrasonic horn with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end of the first tube; and a mechanism for blowing gas into a second end of the first tube.

The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

A wire clamping system for fully automatic wire bonding machine comprises a base, a wire clamping support, a wire clamping assembly, a driving mechanism and an elastic assembly. The wire clamping assembly can move relative to the capillary, so that when the wire clamping system completes the second bond, the metal wire at the end of the capillary may directly extend out of the capillary by the independent movement of the wire clamping assembly and a length thereof can be effectively controlled, in order to form a metal ball in the next first bond. Furthermore, when the wire clamping system completes the second bond, the wire clamping assembly is in a clamping state, which avoids wires flying, even though the second bond is not firmly connected or the machine vibrates.

It is an object to enable a non-destructive inspection of reliability of a bonding part and enabling an accurate inspection. A wedge tool includes: a groove which is formed along a direction of an ultrasonic vibration in a tip portion and in which a bonding wire is disposed in a wedge bonding; a first planar surface and a second planar surface disposed on both sides of the groove; and at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding.

A curtain airbag device mounting structure includes: a first pillar forming a part of a front pillar and extends substantially along a vehicle height direction; a second pillar forming another part of the front pillar, the second pillar being disposed on a rear side of a vehicle relative to the first pillar at a predetermined distance from the first pillar and extending substantially along the vehicle height direction; a transparent member bridged between the first pillar and the second pillar; and a curtain airbag device including a curtain airbag stored along a roof side rail and the second pillar, the curtain airbag being configured to inflate and deploy in a curtain-like fashion over a side portion of a cabin of the vehicle in case of a collision of the vehicle.

A jig for holding a wire bonding capillary includes a first arm and an opening in the first arm, wherein a wire bonding capillary is receivable within the opening. A second arm is pivotally attached to the first arm. The second arm has a surface facing the first arm, wherein the surface is contactable with a capillary mount of a wire bonding machine.

A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.