B23K26/034

Two-color high speed thermal imaging system for laser-based additive manufacturing process monitoring

Monitoring melt pool temperature in laser powder bed fusion by providing a build laser that produces a laser beam that is directed onto the melt pool and produces an incandescence that emanates from the melt pool, receiving the incandescence and producing a first image having a first spectral band and a second image having a second spectral band, and determining the ratio of said first image having a first spectral band and said second image having a second spectral band to monitor the melt pool temperature.

High-precision and high-efficiency laser polishing method oriented to large-size ultra-thin mask plate

The present disclosure relates to a high-precision and high-efficiency laser polishing method oriented to a large-size ultra-thin mask plate, and belongs to the technical field of advanced laser manufacturing. A high-precision and high-efficiency laser polishing technology is applied to the surface smoothness improvement of the large-size ultra-thin mask plate. The high-precision and high-efficiency laser polishing method specifically comprises the four following steps: step one, selecting and placing an ultra-thin invar alloy mask plate on a five-axis machining platform; step two, adopting a nanosecond continuous laser, and setting a laser incident angle; step three, setting N laser polishing areas; and step four, performing laser polishing continuous splicing. Compared with the prior art, the surface smoothness of the mask plate is improved, the polishing efficiency is high, the precision is high, and the influence on the geometrical characteristic size of the appearance of an original mask plate is low.

DEVICE FOR THE ADDITIVE PRODUCTION OF THREE-DIMENSIONAL COMPONENTS
20220152738 · 2022-05-19 ·

A process monitoring system for an additive manufacturing apparatus includes a scanner, a sensor device, and an optical focus-tracking device. The scanner includes an optical adjustment device that directs a melting beam emitted by a laser melting device onto a construction plane to generate a melting section of the construction plane. The sensor device may detect reflected radiation from the melting section and generate sensor data indicative of a size, shape, and/or temperature corresponding to the melting section. The optical focus-tracking device includes a focusing lens located between the scanner and the sensor device. The focusing lens may be actuatable by electronic machine data derived from the sensor data to impart a first focus adjustment with respect to the reflected radiation detected by the sensor followed by a second focus adjustment with respect to the melting beam directed by the optical adjustment device.

ADDITIVE MANUFACTURE
20220134433 · 2022-05-05 · ·

A method of powder bed fusion additive manufacture includes forming a component in a powder bed in a layer-by-layer process. The method may include sintering, without melting, selected regions of powder with an energy beam to form at least one support adjacent to the component; and melting further selected regions of the powder bed with an energy beam to form a component by layer-by-layer melting of material. The method may include directing an energy beam at selected regions of powder to form a friable support, the friable support including bonded powder which act as a solid and provide compressive support; and melting further regions of the powder bed with an energy beam to form a component by layer-by-layer melting of material.

Device and method for electromagnetic induction heating-assisted laser additive manufacturing of titanium matrix composite

The present invention provides a device and method for electromagnetic induction heating-assisted laser additive manufacturing of a titanium matrix composite and belongs to the technical field of laser additive manufacturing. The device includes a coaxial-powder feeding laser deposition system and an electromagnetic induction heating synchronous auxiliary system. The coaxial-powder feeding laser deposition system includes a substrate, a deposition sample, a laser head and an infrared thermometer. The electromagnetic induction heating synchronous auxiliary system includes an electromagnetic induction power supply auxiliary unit, a coil, a steering heightening mechanism, a driven shaft and a transverse sliding groove. The coil is connected to an output end of the electromagnetic induction power supply auxiliary unit. The coil and the laser head do synchronous movement to implement small-area real-time preheating and slow cooling on the deposition sample.

LASER MACHINING METHOD

Provided is a laser machining method with which strain occurring in a workpiece can be reduced even when a large number of through-holes are formed. The laser machining method includes: a gas supply step (S3) of making a gas pressure on the back surface side of a workpiece 1 higher than a gas pressure on the front surface side of the workpiece 1; a deep hole machining step (S5) of irradiating the workpiece 1 from the front surface side with a pulsed laser having a first repetition frequency f1, thereby forming through-holes A in the workpiece 1; and a hole finishing step (S7) of irradiating the inner surface of the through-holes A with a pulsed laser having a second repetition frequency f2 that is lower than the first repetition frequency f1.

Method for Removing Electronic Components Connected to a Circuit Board
20220126398 · 2022-04-28 ·

A device for removing a defective electronic component from a circuit board includes a vacuum suction nozzle, a laser beam emitter and an infrared temperature sensor. The vacuum suction nozzle has a suction opening at which suction is generated. The suction opening is dimensioned to be larger than the defective electronic component. The laser beam emitter is oriented so as to emit a laser beam out the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing the defective electronic component from the circuit board includes positioning the suction opening over the electronic component and directing the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then sucked into the vacuum suction nozzle.

METHOD TO EXECUTE A WELD OF AN ELECTRODE OF A CELL WHICH IS PART OF A BATTERY
20220126400 · 2022-04-28 ·

A method to execute a weld of an electrode of a cell which is part of a battery and having the steps of: causing the electrode to come into contact with another element to which the electrode must be welded; locally heating the electrode and the other element so as to locally cause a melting of the metal making up the electrode and of the metal making up the other element in order to generate a weld pool; waiting for the weld pool to cool down, thus giving stability to the weld; capturing, by means of a video camera, a series of digital images of the weld pool during the heating; analysing the digital images in order to determine a value of at least one parameter of the welding process; and changing the execution of the melting process based on the value of the parameter.

Method for Removing and Repositioning Electronic Components Connected to a Circuit Board
20220132714 · 2022-04-28 ·

A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.

Heating system for fiber-reinforced thermoplastic feedstock and workpiece

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.