A laser beam irradiating apparatus includes a laser oscillator configured to emit a laser beam, a first polarization beam splitter configured to separate the laser beam into a first laser beam of s-polarized light and a second laser beam of p-polarized light, a first spatial light modulator configured to modulate the first laser beam according to a phase pattern, and emit the resulting first laser beam, a second spatial light modulator configured to modulate the second laser beam according to a phase pattern, and emit the resulting second laser beam; a second polarization beam splitter configured to synthesize the first laser beam emitted from the first spatial light modulator and the second laser beam emitted from the second spatial light modulator, and an imaging unit configured to image the synthesized laser beam, and irradiate a target object with the resulting laser beam.

A temperature control method for additive manufacturing includes directing an energy beam of a first energy source toward a material and fusing at least a portion of the material to form a cladding layer, forging the cladding layer with a micro-forging device, and detecting a first internal effect parameter of the cladding layer at a forging position where is forged by the micro-forging device. The first internal effect parameter includes at least one of a stress or a strain of the cladding layer. The method also includes calculating a first calculated temperature of the cladding layer at the forging position based on the first internal effect parameter and adjusting the at least one of the first energy source and the micro forging device if the first calculated temperature does not fall within a desired temperature range.

The invention relates to a method for producing a three-dimensional component by an electron-beam, laser-sintering or laser-melting process, in which the component is created by successively solidifying predetermined portions of individual layers of building material that can be solidified by being exposed to the effect of an electron-beam or laser-beam source (2) by melting on the building material, wherein thermographic data records are recorded during the production of the layers, respectively characterizing a temperature profile of at least certain portions of the respective layer, and the irradiation of the layers takes place by means of an electron beam or laser beam (3), which is controlled on the basis of the recorded thermographic data records in such a way that a largely homogeneous temperature profile is produced, wherein, to irradiate an upper layer, a focal point (4) of the electron beam or laser beam (3) is guided along a scanning path (17), which is chosen on the basis of the data record characterizing the temperature profile of at least certain portions of the layer lying directly thereunder or on the basis of the data records characterizing the temperature profiles of at least certain portions of the layers lying thereunder.

An additive manufacturing apparatus and corresponding method for building an object by layerwise consolidation of material, where the apparatus includes a build enclosure containing a build support for supporting the object during the build, a material source for providing material to selected locations for consolidation, a radiation device for generating and directing radiation to consolidate the material at the selected locations and an acoustic sensing system. The acoustic sensing system may be arranged to detect acoustic signals generated in the build enclosure by consolidation of the material with the radiation. The acoustic sensing system may be a passive acoustic sensing system arranged to detect acoustic signals generated in the build enclosure that are indicative of at least one condition of the building process and/or the object.

A coiling machine includes a laser heating machine configured to irradiate a wire formed into a helical shape with laser light to thereby heat a part of the wire, and cutting components configured to cut a portion of the wire after the irradiation of the laser light is stopped, a temperature of the portion being higher than before irradiated with the laser light.

Device for production of three-dimensional components, namely a laser melting device or laser sintering device, in which a component is produced by successive solidifying of individual layers made from solidifiable construction material, by radiation, through melting of the construction material, wherein the dimensions and/or temperature of the melt area generated by a point-shaped or line-shaped energy input can be captured by a sensor device of a process monitoring system, and sensor values for evaluation of a component quality can by deduced therefrom, wherein the radiation created by the melt area and used for the generation of the sensor values passes through the scanner used for the melt energy input, and guided to the sensor device of the process monitoring system, wherein an optical focus tracking device is arranged in the radiation path used for generation of the sensor values between the scanner and the sensor device.

A laser compression bonding device and method for a semiconductor chip are proposed. The device includes a conveyor unit that transports a semiconductor chip and a substrate, and a bonding head that includes a bonding tool for applying a pressure to the chip and substrate, a laser beam generator for emitting a laser beam, a thermal imaging camera for measuring temperatures of the surfaces of semiconductor chip and substrate, and a compression unit for controlling a pressure applied by the bonding tool and a position thereof, wherein the compression unit includes a mount on which the bonding tool is detachably mounted, and a servo motor and a load cell that apply a pressure to the mount or control a position thereof. The servo motor is controlled with two values for pressure application and positioning.

The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.

An apparatus and a method for thermal processing within a processing region (1) at a workpiece surface (2) by means of a laser beam (6) emitted by at least one radiation source (5). Arranged in the beam path of the laser beam (6) between the at least one radiation source (5) and the processing region (1) on the workpiece surface (2), there is at least one element (10, 11, 12) by means of which the intensity of the laser beam (6) is modifiable in a locally defined manner within the processing region (1). As an alternative or in addition thereto, the intensity of at least one of the laser beams (6) is modifiable in a locally defined manner within the processing region (1) by a defined actuation of the plurality of radiation sources (5) such that a locally defined distribution of the intensity of the laser beam (6) striking the workpiece surface (2) is achievable within the processing region (1).

A line beam irradiation apparatus (1000) includes a work stage (200), a line beam source (100) for irradiating a work (300) placed on the work stage (200) with a line beam; and a transporting device (250) for moving at least one of the work stage (200) and the line beam source (100) such that an irradiation position of the line beam on the work moves in a direction transverse to the line beam. The line beam source includes a plurality of semiconductor laser devices and a support for supporting the plurality of semiconductor laser devices. The plurality of semiconductor laser devices are arranged along a same line extending in a fast axis direction, and the laser light emitted from emission regions of respective ones of the semiconductor laser devices diverge parallel to the same line to form the line beam.