A laser reflow apparatus reflows solder bumps disposed on a side of a semiconductor chip in a workpiece and included in an irradiation range on the workpiece by applying a laser beam to an opposite side of the semiconductor chip. The laser reflow apparatus includes a spatial beam modulation unit including a laser power density setting function to locally set the laser power density in the irradiation range of a laser beam emitted from a laser beam source, and an image focusing unit including an image focusing function to focus the laser beam emitted from the laser beam source and apply the focused laser beam to the irradiation range on the workpiece.

A tool for laser beam processing is provided. The tool includes an upper tool and a lower tool, which are able to be advanced toward one another by way of a press, such that at least one component is able to be fixed in a predefined position between the upper tool and the lower tool. At least one laser beam exit surface, which is part of an inner surface of the upper tool or lower tool, and at least one laser beam guide, into which laser radiation is able to be coupled and is able to be directed through the laser beam exit surface onto a processing location on the component are provided. A control device, which enables and/or disables the coupling of laser radiation into the at least one laser beam guide depending on the advancing movement between upper tool and lower tool is provided. Furthermore, a laser beam processing apparatus and a method for laser beam processing are also provided.

An additive manufacturing system is disclosed that comprises two or more lasers for precisely heating a fiber-reinforced thermoplastic feedstock and a fiber-reinforced thermoplastic workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system employs feedforward, a variety of sensors, and feedback to ensure that the feedstock and workpiece are properly heated.

A side trimming device according to an embodiment of the present invention may comprise: a cutting unit for mechanically cutting a transferred steel plate; a groove forming unit for forming a groove in a cutting-scheduled area in front of the cutting unit with reference to the steel plate transfer direction; and a washing unit arranged adjacent to the groove forming unit so as to suction molten material accumulating in the groove in the side direction of the steel plate.

A method for welding a flexible film (10) to a carrier component (20) having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flow of a fluid, and 2) laser welding the film (10) on the carrier component (20).

Provided is a method of welding laminated metal foils that can prevent blowholes and spatter from being formed. It is a method of welding laminated metal foils sandwiched between a pair of metal plates to the pair of metal plates. The method of welding laminated metal foils sandwiched between a pair of metal plates to the pair of metal plates includes locally pressing and crimping the laminated metal foils sandwiched between the pair of metal plates at a welding point in a laminating direction, and welding the crimped pair of metal plates and laminated metal foils at the welding point.

A method for connecting two components with the aid of a laser weld seam. The two components are situated one above the other in a joining area. The first component is pressed in the direction of the second component with the aid of a clamping device. A laser beam impacts the first component on the side facing away from the second component and at least indirectly fusing material of the two components.

The invention relates to a method for producing modifications (9) in the interior of a solid body (1). The method comprises the introduction of laser radiation (14) of a laser (29) into the interior of the solid body (1) via a first surface (8) of the solid body (1). The solid body (1) forms a crystal structure. Modifications (9) are produced at predefined points in a production plane (4) in the interior of the solid body (1) by the laser radiation (14). The modifications (9) are closer to the first surface (8) than to a second surface, the second surface being parallel to the first surface (8). A plurality of linear forms (103) can be produced by the modifications (9). The solid body (1) cracks subcritically in the region of each modification (9). The subcritical cracks have an average crack length of less than 150 m orthogonally to the direction of longitudinal extent of the linear form in question. Modifications (9) that belong to the same linear form (103) and that are produced one after the other are produced at a distance from each other that is defined by the function (dx)/d<0.31, where x>d.

An image forming apparatus includes an oscillator configured to oscillate a laser beam, an irradiation portion configured to radiate the laser beam oscillated by the oscillator to an outside, a light absorption unit configured to absorb the laser beam and to convert the laser beam to heat, and a control unit including at least one processor and at least one memory. The control unit is configured to control the irradiation portion to press the irradiation portion against a workpiece via the light absorption unit and irradiating the workpiece with the laser beam via the light absorption unit, so as to perform image forming processing.

A device and method for alignment of parts for welding, having a bottom welding fixture and a top welding fixture. The bottom welding fixture has a plurality of fixed locating pins for positioning of parts to be welded and limiting movement of the parts in a first axis and a perpendicular second axis. At least pair of alignment block assemblies to actuate movement of the parts to be welded in the first and second axes. The alignment block assembly having an alignment block moveable from a first position to a second position for contacting and aligning the parts. An actuator coupled to the top welding or bottom welding fixture to actuate movement of the alignment block from the first position to the second position upon engagement of the top welding fixture to the bottom welding fixture.