A machine learning apparatus able to obtaining an optimal shift amount of an assist gas. The machine learning apparatus comprises a state-observation section configured to observe machining condition data included in a machining program given to the laser machine, and measurement data of a dimension of dross generated at a cutting spot of the workpiece when the machining program is executed, as a state variable representing a current state of an environment in which the workpiece is cut; and a learning section configured to learn the shift amount in association with cutting quality of the workpiece, using the state variable.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Methods, devices, and systems for welding optical fibers and perforated elements by pulsed laser beam are provided. In one aspect, a method includes focusing a pulsed laser beam onto a region of a joining surface formed by an outer circumference of an optical fiber and an inner circumference of a hole of a perforated element, a beam direction of the pulsed laser beam running in an axial direction of the joining surface, and moving a laser focus of the pulsed laser beam in the region axially in or counter to the beam direction to produce at least one weld seam in the region. The optical fiber and the perforated element are locally melted in the region by the pulsed laser beam focused into a material of the optical fiber and a material of the perforated element and are thereby welded to one another.

A laser processing machine 100 includes: a laser processing unit 1 configured to process a workpiece W by using a laser beam L; an imaging device configured to image the workpiece W irradiated with the laser beam L; and a control device configured to control the laser processing unit 1 in accordance with a processing condition 51c for processing the workpiece W. The control device controls operation of the laser processing unit 1 such that size OIS of an optical image OI and a peak value PV of light intensity LI of the optical image OI observed from image information obtained by imaging the workpiece W with the imaging device approach preset reference values 60.

A busbar includes: a plurality of members that are platy; and a welding area in which two of the members are welded, the welding area being linear and extending in a first direction, the welding area being provided approximately between both ends of at least one of the two members in the first direction.

A laser cutting head includes a controllable collimator with movable collimator lenses for controlling beam diameter and/or focal point location. The laser cutting head may be used in a laser cutting system with a control system for controlling the position of the movable collimator lenses. The lenses may be moved, for example, to adjust the beam spot size for cutting different types of material or material thicknesses. The lenses may also be moved to adjust a focal point back to the workpiece after changing the distance of the laser cutting head relative to the workpiece.

The present disclosure relates to a beam analysis device for determining a light beam state, e.g., determining the focal position of a light beam, where the device has a partial beam imaging device having at least one first selection device for forming a first partial beam from a first partial aperture region of the first measurement beam, and an imaging device for imaging the first partial beam for generating a first beam spot onto a detector unit having a spatially-resolving detector. The beam analysis device also can have an evaluation unit for processing the signals of the detector unit, for determining a lateral position (a.sub.1) of the first beam spot, and for determining changes in the lateral position (a.sub.1, a.sub.1′) of the first beam spot over time. An optical system for focal position control with a laser optics and with a beam analysis device. Additionally, the disclosure relates to a corresponding beam analysis method and methods for focal position control of a laser optics and for focal position tracking of a laser optics.

The present disclosure relates to a beam analysis device for determining a light beam state, e.g., determining the focal position of a light beam, where the device has a partial beam imaging device having at least one first selection device for forming a first partial beam from a first partial aperture region of the first measurement beam, and an imaging device for imaging the first partial beam for generating a first beam spot onto a detector unit having a spatially-resolving detector. The beam analysis device also can have an evaluation unit for processing the signals of the detector unit, for determining a lateral position (a.sub.1) of the first beam spot, and for determining changes in the lateral position (a.sub.1, a.sub.1′) of the first beam spot over time. An optical system for focal position control with a laser optics and with a beam analysis device. Additionally, the disclosure relates to a corresponding beam analysis method and methods for focal position control of a laser optics and for focal position tracking of a laser optics.

A laser processing system capable of reliably determining an abnormality in a jet during laser process. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure any of the velocity of the jet and a sound generated by the jet impinging on a workpiece; and an abnormality determination section configured to determine whether or not output data of the measuring instrument is different from reference data.