A laser apparatus may include a laser generator generating at least one a laser beam, which is used as an input light, an optical system converting the input light, which is provided from the laser generator, into a plurality of pattern lights, and a stage, on which a target object is loaded. The output light may be irradiated onto the target object. The optical system may divide the input light into a plurality of divided lights, and the pattern lights may be produced by constructive interference of the plurality of divided lights. A diameter of each of the pattern lights may be smaller than a diameter of the input light.

An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

A coherent beam coupled laser diode array includes an array of laser diodes. Each diode emits a beam propagating along a beam path. An array of collimation optics is included. Each of the collimation optics collimates one beam. A first lenslet array is included. Each lenslet refracts a portion of one beam and a portion of a different beam from the array. A partially reflecting mirror is included. A first portion of each beam propagates through the partially reflecting mirror and a second portion of each beam is reflected back toward the first lenslet array. The second portion of each beam reflected propagates back through the first lenslet array and the collimation optics and into one of the diodes in the array of laser diodes, thereby creating an optical cross coupling. A second lenslet array collimates each beam propagating through each lenslet to form a single laser beam.

The apparatus for 3D laser printing by fusing a metal wire material is provided. The zone of fusion is heated and fused by a plurality of laser beams which uniformly converge into the focal area around the tip of the metal wire material by a focusing lens into a focal point on an object-formation table. The optical and wire feeding units are stationary, while the object-formation table is moveable under command of a computer along a pre-programmed spatial trajectory.

An optical fiber module is provided and includes an optical fiber structure, a light-absorbing area and a photoelectric sensor in a housing. The optical fiber structure collectively arranges a plurality of first optical fibers to form at least one optical fiber bundle with a tapered end, and a second optical fiber is connected to the tapered end of the optical fiber bundle to converge the optical fiber bundle to the second optical fiber. The light-absorbing area corresponds to an end of the second optical fiber, such that the light-absorbing area absorbs scattering signals escaped and scattered when signals are transmitted from the plurality of first optical fibers to the second optical fiber. The photoelectric sensor is arranged corresponding to the plurality of first optical fibers to receive target signals escaped and refracted when the signals are transmitted from the second optical fiber to the plurality of first optical fibers.

A laser processing apparatus includes: a laser light source configured to generate a laser beam; a plurality of scanners, wherein each of the plurality of scanners is configured to move the laser beam along a processing path so that the laser beam is irradiated onto a corresponding workpiece of a plurality of workpieces, respectively; a plurality of lenses respectively disposed between the plurality of scanners and the plurality of workpieces; and a measuring circuit spaced apart from the plurality of lenses with the plurality of workpieces interposed therebetween, wherein: the measuring circuit moves along a measuring path and measures a characteristic of the laser beam; and the measuring path overlaps the processing path of each of the plurality of scanners.

The three-dimensional shaping device (100) is provided with a layer forming device (10) to form a layer of metal powder (90) on a shaping object, and a laser light irradiation device (20) to irradiate the layer of metal powder (90) formed by the layer forming device (10) with a laser light (25). The laser light (25) to be used in the three-dimensional shaping device (100) has a pulsed output waveform with a frequency of 5 to 200 kHz, a pulse width of 5 to 200 μs and a peak output of 10 to 500 W. Further, an overlap rate, which is a rate at which irradiation spots on the layer of metal powder (90) by two successive pulses of the laser light (25) overlap with each other, is 50 to 99.9%. Hereby, it is possible to provide a three-dimensional shaping method and a three-dimensional shaping device which can shape a shaping body having a narrower shaping width.

A method for butt laser welding two metal sheets includes providing a first metal sheet and a second metal sheet and butt welding the metal sheets along a direction of welding. The butt welding step includes simultaneously generating a first front keyhole in the first metal sheet, generating a second front keyhole in the second metal sheet, and generating a back keyhole in the first and second metal sheets. The first and second front laser beams and the back laser beam are configured in such a manner that at each moment in time, a solid phase region and/or a liquid phase region of the metal sheets remains between the first front keyhole and the back keyhole and between the second front keyhole and the back keyhole.

Some variations provide a method of making an additively manufactured single-crystal metallic component, comprising: providing a feedstock comprising a first metal or metal alloy; providing a build plate comprising a single crystal of a second metal or metal alloy; exposing the feedstock to an energy source for melting the feedstock, generating a melt layer on the build plate; and solidifying the melt layer, generating a solid layer (on the build plate) of a metal component. The solid layer is also a single crystal of the first metal or metal alloy. The method may be repeated many times to build the part. Some variations provide a single-crystal metallic component comprising a plurality of solid layers in an additive-manufacturing build direction, wherein the plurality of solid layers forms a single crystal of a metal or metal alloy with a continuous crystallographic texture. The crystal orientation may vary along the additive-manufacturing build direction.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.