The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool.

A laser machining device comprises a movable stage which is controlled by a stage controller. A laser produces a beam for machining and the beam is scanned over the part using a laser scanner under control of the laser scanner. The scanner controller controls the stage controller to synchronize movements of the stage with movements of the scanner. The stage may carry the part to be machined or the scanner.

A laser processing head can be used for joining (e.g., welding, brazing, soldering, etc.) workpieces. A collimator collimates laser light, which passes to a beam splitter. The beam splitter has anti-reflective and high-reflective coatings on peripheral and inner areas of the beam splitter. The beam splitter splits the collimated light into central or inner light from the inner area and peripheral light from the peripheral area. A main output in communication with the beam splitter directs at least the peripheral light into a main beam toward the workpieces. For example, a cable can feed a brazing wire adjacent the main beam for brazing the workpieces together. Meanwhile, a secondary output in communication with the beam splitter directs at least the central light into a secondary beam, which can be used to pre-heat the workpiece, post-heat the workpiece, or remove any surface coating from the workpiece.

An irradiation device for additively manufacturing three-dimensional objects may include a beam generation device that includes a plurality of laser diode arrays. Respective ones of the plurality of laser diode arrays may include a plurality of diode emitters respectively configured to emit an energy beam. The plurality of laser diode arrays may be longitudinally offset relative to one another, and the plurality of laser diode arrays may be laterally offset relative to one another.

Laser welding methods include focusing laser radiation onto a first metal sheet disposed on a metal part, optionally with one or more intervening metal sheets therebetween. The laser radiation is steered to trace at least one spiral path to spot-weld together the metal parts. The laser radiation includes a center beam and an annular beam to maintain a stable keyhole. One method is tailored to weld aluminum parts, e.g., with high gas content and/or dissimilar compositions, and the laser radiation traces first an outward spiral path and then an inward spiral path. The center beam is pulsed during one segment of the inward spiral path. Another method is tailored to weld steel or copper parts having a coating at an interface therebetween, and the laser radiation traces an inward spiral path. The interface may be a zero-gap interface, or a non-zero gap may exist.

Systems and techniques for optimizing the operation of a beam emitter during material processing maintain an optimal polarization of the beam with respect to the material throughout processing—e.g., even as the beam path varies or the nature or thickness of the material changes.

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

A 3D additive manufacturing machine and an additive manufacturing method for manufacturing objects layer by layer, to obviate a need for a rotating prism. The machine can fill spaces in any one layer between paths generated by neighboring illumination spots from an array by sweeping subsequent paths between previously manufactured paths or by meandering along the paths. As a consequence, sufficient intensity may be provided for 3D additive manufacturing, even when using LEDs as a light sources.

A laser processing device comprising: an optical arrangement; wherein the optical arrangement comprises an input for receiving a laser beam; wherein the optical arrangement comprises a beam splitter that splits the laser beam into at least two partial beams; wherein the optical arrangement recombines the partial beams into a laser spot for generating an interference pattern in the laser spot; wherein a first state of the laser beam at the input generates a first interference pattern and a second state of the laser beam generates a second interference pattern; wherein the first state and the second state differ in at least one of (i) a position of the laser beam at the input and (ii) an angle of incidence of the laser beam with respect to the input; and wherein the optical arrangement is configured such that the second interference pattern continues the first interference pattern in phase.