Disclosed is a method for manufacturing stress-relief-annealing-resistant, low-iron-loss grain-oriented silicon steel, the method comprising: carrying out, by means of a pulse laser, scanning grooving on a single surface or two surfaces of a silicon steel sheet after cold rolling, or after decarburizing annealing, or after high temperature annealing or after hot stretching, temper rolling and annealing, and forming several grooves parallel with each other in a rolling direction of the silicon steel sheet, wherein a single pulse time width of the pulse laser is 100 ns or less, and a single pulse peak energy density is 0.05 J/cm.sup.2 or more; the energy density of a single scan of a single laser beam is 1 J/cm.sup.2 to 100 J/cm.sup.2; a beam spot of the pulse laser is a single beam spot or a combination of a plurality of beams spots, the shape of the beam spot is circular or elliptic, and the diameter of the beam spot in a scanning direction is 5 μm to 1 mm, and the diameter thereof in a direction perpendicular to the scanning direction is 5 μm to 300 μm; and when scanning grooving is carried out at the same position on the silicon steel sheet, the product of the number of beam spots of the pulse laser and the scan times is 5 or more.

The linear groove formation method includes a resist forming process of forming a coated resist on a surface of a steel sheet, a laser irradiating process of irradiating laser beams onto the steel sheet while repeating a laser scanning in a direction intersecting a rolling direction of the steel sheet cyclically in the rolling direction of the steel sheet to remove the coated resist in portions irradiated with the laser beams, and an etching process of forming linear grooves by etching portions of the steel sheet from which the coated resist is removed. In the laser irradiating process, the coated resist is removed by using two or more laser irradiating devices, with a certain irradiation energy, a certain beam diameter in a direction perpendicular to a laser scanning direction, and a certain incidence angle with respect to the surface of the steel sheet.

A method for laser material processing includes generating a first pulsed laser beam that forms a first focus zone, and processing the material with the first pulsed laser beam in order to produce first modifications. The first modifications form a shielding surface. The method further includes generating a second pulsed laser beam that forms a second focus zone, which is formed in elongated fashion along a second focus zone axis and is formed by constructive interference of laser radiation that passes at an angle toward the second focus zone axis. The method further includes processing the material with the second pulsed laser beam to produce second modifications in a second section of the material. At least one part of the laser radiation passes at the angle toward the second focus zone axis impinges on the shielding surface.

A substrate processing system configured to process a substrate includes an eccentricity detection device configured to detect, in a combined substrate in which a first substrate and a second substrate are bonded to each other, an eccentricity of the first substrate; a modification layer forming device configured to form a modification layer within the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate; and a periphery removing device configured to remove the peripheral portion starting from the modification layer.

An optical combiner includes: a plurality of first input optical fibers that each include a core; a bridge fiber that includes a bridge input surface connected to the cores of the plurality of first input optical fibers, a diameter reduction portion having a diameter that decreases away from the bridge input surface along an optical axis of the optical combiner, and a bridge output surface located opposite to the bridge input surface along the optical axis; an intermediate optical fiber that includes a core connected to the bridge output surface of the bridge fiber; a second input optical fiber that includes a core; and an output optical fiber that includes a first optical waveguide connected to the core of the intermediate optical fiber, and a second optical waveguide connected to the core of the second input optical fiber.

A glass plate processing method for dividing a glass plate by a separation line that divides a main surface of the glass plate into two regions, includes: moving an irradiation point of a first laser beam along the separation line, and forming a crack extending from the separation line diagonally with respect to the main surface, in a cross-section orthogonal to the separation line; after the crack is formed, moving an irradiation point of a second laser beam along the separation line, and forming a modified portion, in the cross-section, on a virtual line extending in a direction perpendicular to the main surface, from a tip of the crack towards a center of a thickness of the glass plate; and after the modified portion is formed, applying stress to the glass plate and forming a new crack spanning from the tip of the crack to the modified portion.

In some embodiments, a method includes engraving, marking and/or inscribing a workpiece using a laser plotter. In said method, in a housing of the laser plotter, one, preferably more, in particular two laser sources in the form of lasers have an effect preferably alternating on the workpiece to be processed. The workpiece is laid in a defined manner on a processing table and a laser beam emitted from the beam source (4) is transmitted to at least one focusing unit via deflection elements and the laser beam is diverted toward the workpiece and focused for processing. The workpiece, in particular the position of the work piece in relation to the laser beam, is controlled by means of software running in a control unit, such that the workpiece is processed line by line by the displacement of a carriage. A sequence control adapted to the quality of the engraving in which a defined ratio of a spot variable to the line distance and an engraving controller of the lines to be processed is determined and/or carried out by the control unit and the focusing unit on the carriage is controlled corresponding to the defined parameters of the sequence control.

A semiautomatic apparatus for surface treatment of items of clothing using a laser source, in which the items have front, rear and side surfaces, the apparatus includes support means, rotating about substantially vertical axes, movement means for moving the support means and laser means for surface treatment of the items. The laser means include at least one first laser generator and a second laser generator for directing laser beams respectively to the front, the rear and/or the side surfaces of the items to be treated, and the support means include multiple arms configured to move from a loading/unloading station for an item to be treated or being treated to two work stations for the items to be treated. A passage is provided for an operator to access the loading/unloading station, the generators are located at opposite sides of the passage to avoid interference of the laser beams with the operator.

A double fibre laser cutting system for laser cutting sheet metal that comprises: a cutting machine with a mobile gantry and fixed metal sheets, multiple heads both for straight cutting and bevel cutting, multiple cutting sources in each head, automated means for changing the cutting source in each head, means for controlling all the elements, wherein the multiple cutting sources in each head is carried out by means of two fibres sent from corresponding generator outlets to each head. The simultaneous cutting of one or more metal sheets with different thicknesses is achieved and, consequently, maximum laser cutting capacity in useful length, and in useful width, the use of a single generator, and the automatic adjustment of cutting conditions in accordance with the thicknesses, straight and bevel cutting simultaneously in multiple heads.

A laser device includes: a plurality of laser diodes that emit laser beams having different wavelengths; a partial reflection mirror that resonates the plurality of laser beams emitted by the plurality of laser diodes; and a wavelength dispersion element that causes the plurality of laser beams incident from the plurality of laser diodes in different orientations of optical axes of the laser beams to travel to the mirror with the optical axes aligned. Each of the plurality of laser diodes is integrally formed with an adjustment component that is rotatable around an emission end of the laser diode.