Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

According to one embodiment, an optical machining apparatus includes a first light source, and a second light source. The first light source is configured to radiate a first beam onto a first position of a surface of a work in such a manner as to transfer heat at a temperature lower than a melting temperature of the work from the first position of the work to a second position of a surface of the work on an opposite side to the first position. The second light source is configured to radiate a second beam onto the second position such that a temperature of the work exceeds the melting temperature of the work, in a state in which a temperature of the second position is raised by the transfer of the heat.

A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

In various embodiments, a workpiece is processed utilizing one or more output beams emitted from a step-core optical fiber and formed from one or more input beams that may have non-circular beam shapes. In various embodiments, an input beam may be a variable-power laser beam having a laser-beam numerical aperture (NA) that varies as a function of the power of the laser beam. The step-core optical fiber may have an outer core NA that is greater than or equal to the laser-beam NA at a laser power of approximately 100%, an inner core NA that is less than or equal to the outer core NA, and an inner core NA that is greater than or equal to the laser-beam NA at a power of 50%.

A method of processing a workpiece having a first surface and a second surface opposite the first surface includes: generating a first beam of laser pulses having a pulse duration less than 200 ps at a pulse repetition rate greater than 500 kHz, directing the first beam of laser pulses along a beam axis intersecting the workpiece, and scanning the beam axis along a processing trajectory. The beam axis is scanned such that consecutively-directed laser pulses impinge upon the workpiece at a non-zero bite size to form a feature at the first surface of the workpiece. One or more parameters such as bite size, pulse duration, pulse repetition rate, laser pulse spot size and laser pulse energy is selected to ensure that the feature has a processed workpiece surface with a mean surface roughness (Ra) of less than or equal to 1.0 μm.

Provided is a roller laser texturing processing equipment and its processing method, comprising the following steps: dividing the processing area, determining the distribution scheme: obtaining a distribution scheme of end-to-end, unordered and uniform texturing lattice according to said roller processing unit parameters and morphological parameters; determining the output signal: the laser output position signal, beam energy regulation signal and deflection signal of one-dimensional beam deflection unit are obtained through the information processing module; performing roller laser texturing processing: said laser output position signal is used to control the light source module to emit the laser; said beam energy regulation signal and deflection signal of one-dimensional beam deflection unit are input into the laser terminal output module, respectively, to generate an unordered laser lattice, each laser terminal output module is used to process a roller processing unit. The present invention can guarantee the unordered degree of the texturing points and the uniformity of the morphology distribution at the same time, the surface consistency of the produced cold-rolled plate is better in the subsequent coating treatment.

A laser processing device and a laser processing method are provided. The laser processing device includes: at least two lasers each configured to generate a laser beam; focusing members corresponding to the at least two lasers respectively and configured to adjust focus positions of at least two laser beams generated by the at least two lasers; and a beam combination member configured to receive the at least two laser beams whose focus positions have been adjusted, and output the at least two laser beams coaxially.

An additive manufacturing system includes one or more processors configured to determine one or more geometrical characteristics of each of multiple segments of a build part at a candidate position relative to an additive manufacturing instrument. The one or more geometrical characteristics include an angle of incidence between a beam line extending from a beam source and a surface normal of a respective skin of the corresponding segment proximate to the beam line. The one or more processors are configured to control the additive manufacturing instrument, based on the one or more geometrical characteristics, to direct focused energy beams from a first orientation relative to the build part to form a first segment of the segments of the build part and to direct focused energy beams from a second orientation relative to the build part to form a second segment of the segments of the build part.

Methods and apparatus for forming holes through a substrate are provided herein. In some embodiments, a method of forming holes in a substrate for use in a process chamber includes: partially forming the plurality of holes in a substrate using a first drill to form a plurality of rough holes through the substrate from a first side of the substrate to an opposite second side of the substrate; positioning the substrate between a second drill and a third drill; using the second drill to finish the plurality of rough holes from the first side of the substrate to a first location at least halfway along the length of each hole of the plurality of rough holes; and using the third drill to finish the plurality of rough holes from the second side of the substrate to at least the first location along the length of each hole of the plurality of rough holes.

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.