A laser beam machine includes a laser oscillator that emits a machining laser beam, an irradiation optical system that irradiates a workpiece with a machining laser beam, a laser array that has a plurality of laser elements disposed in an array and emits an illumination laser beam by output of the plurality of laser elements, an illumination optical system that illuminates the workpiece with the illumination laser beam emitted by the laser array, and an imaging unit that images the workpiece which is illuminated by the illumination optical system with the illumination laser beam.

An apparatus for manufacturing an axi-symmetric part. The apparatus includes a vessel configured to contain the powder. The vessel is also configured to receive a part such that at least a portion of the part contacts the powder contained within the vessel. A first energy source is configured to generate a first beam of energy. The first beam of energy is configured to melt the powder at a first predetermined location such that the melted powder fuses to the part.

An SiC wafer is produced from an SiC ingot by a method that includes a first modified layer forming step and a second modified layer forming step. In the first step, a first laser beam having a first power forms a plurality of discrete first modified layers at a first depth inside the ingot. In the second step, a second laser beam having a second power greater than the first power is applied to the ingot with the second laser beam focused at a depth greater than the first depth. A beam spot of the second laser beam overlaps any one of the plural first modified layers, thereby continuously forming a plurality of second modified layers connected in a line at the first depth. Cracks are formed on both sides of the line of the plural second modified layers so as to extend along a c-plane in the ingot.

This invention provides an effective and a method of laser processing for separating semiconductor devices formed on a single substrate (6) or separating high thickness, hard and solid substrates (6), which is rapid. During preparation of the device or substrate (6) for the cleaving/breaking/dicing procedure an area of damage (8, 11) is achieved by obtaining deep and narrow damage area along the intended line of cleaving. The laser processing method comprises a step of modifying a pulsed laser beam (1) by an focusing unit (1), such as that an “spike”-shaped beam convergence zone, more particularly an above workpiece material optical damage threshold fluence (power distribution) in the bulk of the workpiece (6) is produced. During the aforementioned step a modified area (having a “spike”-type shape) is created. The laser processing method further comprises a step of creating a number of such damage structures (8, 11) in a predetermined breaking line by relative translation of the workpiece (6) relative the laser beam (1) condensation point.

Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. In some embodiments, a system includes a laser that emits a laser beam, a beam homogenizer configured to shape the laser beam into a shaped laser beam having a beam profile, and a lenslet array. The beam homogenizer shapes the laser beam such that at least a portion of the beam profile is substantially uniform in power. The lenslets of the lenslet array have the same shape and each receive a respective portion of the shaped laser beam to output a plurality of laser sub-beams. The plurality of laser sub-beams can be directed toward one or more layers of material to generate or modify a plurality of features on the one or more layers in parallel.

Provided is an apparatus for forming a tab from a moving original sheet with a laser beam. This apparatus is a tab forming apparatus in a tabbed electrode sheet producing apparatus (100) for moving, in one direction, an original sheet (1) including an electrode portion (1a) obtained by applying an active material layer to a long metal foil (4) and an ear portion (1b). This tab forming apparatus includes: a laser emission device (50) configured to apply a laser beam (L1) to the moving ear portion (1b) to cut out a tab (5) connected to the electrode portion (1a); an ear portion separating portion (70) provided at a position above or below a moving plane on which the electrode portion (1a) moves, on a downstream side of an irradiation point (Pm) of the laser beam (L1), so as to cause a take-up angle (α) to occur at the irradiation point (Pm) between the ear portion (1b) from which the tab (5) has been cut out and the moving plane; and an ear portion collection portion (80) configured to collect the ear portion (1b) in synchronization with the movement of the original sheet (1), while applying tension to the ear portion (1b) from which the tab (5) has been cut out with the laser beam L1.

A linear groove formation method including forming a coated resist on a surface of a steel sheet, irradiating two or more laser beams onto the surface of the steel sheet while scanning the laser beams in a direction intersecting the rolling direction of the steel sheet cyclically in a rolling direction of the steel sheet, and forming linear grooves by etching portions of the steel sheet. In the laser irradiating process, the coated resist is removed continuously in a sheet transverse direction of the steel sheet by using the laser beams irradiated from respective ones of two or more laser irradiation devices arranged in the sheet transverse direction, and the laser beams are irradiated by shifting centers of two of the laser beams irradiated from two of the laser two of the laser irradiation devices adjacent to each other in the sheet transverse direction.

A laser-based additive manufacturing system tailored to be material specific based on the laser wavelength or frequency used. The system adjusts the frequency/wavelength of the laser during the process to improve coupling efficiency and/or tailor heating and cooling profiles of different materials.

A beam coupling device includes a light source, optical units, and a coupling optical system. The light source includes light emitters arranged in a first direction and a second direction, to emit light beams having a light ray direction intersecting the first and second directions from each of the light emitters. The optical units are arranged to guide each light beam for each set of light emitters arranged in the first direction in the light source. The coupling optical system is arranged to couple the light beams guided by each optical unit. Each of the optical units is arranged to direct outward the light ray direction of the light beam emitted by a light emitter that is located outside in the first direction for the set of light emitters, to guide the light beam from the light emitter into the coupling optical system.

A marking device, a medium, a container, and a marking method. The marking device includes a first marker including a first optical system having a first focal point, the first marker being configured to concentrate a first light onto a first area of a non-planar portion of a medium to perform marking on the first area, the non-planar portion including a plurality of areas including the first area and a second area, and a second marker including a second optical system having a second focal point. The second marker is configured to concentrate a second light onto the second area to perform the marking on the second area, and the second focal point of the second optical system is different from the first focal point of the first optical system in a direction parallel to a central axis of the first optical system.