An uncoiling and blanking method includes uncoiling a coiled strip, straightening, cutting off the leading end, moving into a looper, moving out of the looper, then cleaning the surface of the coiled strip, and flattening; conveying the coiled strip on a pinch roller to perform laser cutting and blanking, wherein dual static laser cutting heads are used for cutting the coiled strip during the laser cutting, and the cut-away waste materials fall down from the cutting region and are conveyed to the outside; and after the completion of cutting, finally cutting off the obtained sheets from each other, receiving them by a receiving device and conveying same on a conveying belt to a picking up and stacking region to stack the sheets. An uncoiling and blanking method of the present invention adopts laser static cutting, can effectively improve the operation speed and yield by means of cooperative operation of two laser cutting heads, replaces the die blanking method, and has no die or maintenance cost associated therewith, requires no die stacking space, has a more flexible operation mode, simplifies the layout of the production line, and is easy to handle.

A wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot including a separation start point forming step of setting the focal point of a laser beam inside the ingot at a predetermined depth from the ingot's upper surface, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form: (i) a modified layer parallel to the ingot's upper surface, and (ii) cracks extending from the modified layer, thus forming a separation start point. Preferably, the laser beam includes a plurality of laser beams to be simultaneously applied to form a plurality of linear modified layers. The focal points of the laser beams are arranged with predetermined spacing in the direction of formation of an off angle.

A method for controlling the exposure of a selective laser sintering or laser melting apparatus. The method includes providing a selective laser sintering apparatus or laser melting apparatus that uses successive solidification of layers of a powder-type construction material that can be solidified using radiation. The apparatus comprises an irradiation device for irradiating layers of the construction material that has a plurality of scanners that can separately be actuated, simultaneously irradiating the construction material, the separate detection of irradiation times of each scanner and/or the irradiation areas detected by each scanner, and storing the detected irradiation times and/or irradiation areas; comparing the irradiation times and/or irradiation areas of the scanners with each other; re-determining the surface sections of a powder layer to be irradiated by each scanner so the irradiation times for each scanner are approximated to each other and/or the irradiation areas of each scanner are aligned.

The present disclosure is directed toward a machine tool configured to perform small-scale, high-accuracy drilling operations for small-hole applications. The small-hole applications for which the machine tool is designed includes holes with one or more diameters. A part may have a larger-diameter hole that penetrates through a fraction of the thickness of a part and a smaller-diameter hole that penetrates from the bottom of the larger-diameter hole through the remainder of the part thickness. Additionally, the machine tool may be used with parts in any of the following categories: (i) both the step-hole and the flow-hole are created using the machine tool; or, (ii) the step-hole is created with an up-stream process and the machine tool may accept the part, measure the step-holes and create the flow-holes; or, (iii) no step-hole is used and the machine tool may accept the part, measure the raw surface and create the flow-holes.

A substrate processing apparatus includes a holder configured to hold a combined substrate; a peripheral modifying device configured to form a peripheral modification layer to an inside of a first substrate along a boundary between a peripheral portion and a central portion; an internal modifying device configured to form an internal modification layer to the inside of the first substrate along a plane direction; a holder moving mechanism configured to move the holder in a horizontal direction. The peripheral modifying device radiates laser light for periphery to the inside of the first substrate while moving the holder to perform eccentricity correction. The internal modifying device radiates laser light for internal surface without performing the eccentricity correction at least at a center portion of the inside of the first substrate.

A visible light laser system and operation for welding materials together. A blue laser system that forms essentially perfect welds for copper based materials. A blue laser system and operation for welding conductive elements, and in particular thin conductive elements, together for use in energy storage devices, such as battery packs.

A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

A light detection and ranging system including a mounting connection of a lens system in a mounting structure, including a lens system mounted in the mounting structure, the mounting connection including that the mounting structure includes at least one alignment opening, and the lens system includes a mounting shaft configured to mount the lens system in the mounting structure, wherein the alignment opening laterally surrounds the mounting shaft at least in part spaced apart in an alignment distance from the mounting shaft in the predefined alignment condition; and a spacer configured to span at least in part the alignment distance, wherein the mounting shaft is fixed in the alignment condition in the alignment opening by a first connection that fixes the spacer to the mounting structure, and by a second connection that fixes the spacer to the mounting shaft.

A laser processing method includes a laser light emitting step of emitting a pulsed laser light along a line from a back surface of a target having a functional element layer on side of a front surface. The laser light emitting step includes: a first step of irradiating the functional element layer with a first pulsed laser light along the line, to form a weakened region in the functional element layer along the line; and a second step of emitting a second pulsed laser light into the target to follow the first pulsed laser light along the line, to form a crack reaching the front surface along the line in the target. The first pulsed laser light has a pulse width that is shorter than a pulse width of the second pulsed laser light.

A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.