Deep learning is performed by using a material of a processing object, a laser beam parameter showing a property of laser beam which the processing object is irradiated with, and pre-processed part data and post-processed part data that respectively reflect laser processing-involved three-dimensional shapes of a processed part before and after irradiation of the processing object with the laser beam. A first relationship of input data that are the material of the processing object, the pre-processed part data, and the laser beam parameter to output data that is the post-processed part data after irradiation with the laser beam in relation to the input data is accordingly obtained as one learning result.

Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

The present disclosure relates to a laser cutting system including a processing machine provided to perform laser cutting on a processing target using a laser beam according to a predetermined processing design to divide the processing target to form a product having a shape corresponding to the processing design; a setting module for preparing, according to predetermined processing conditions, a process recipe including a plurality of set values for testing of processing parameters that affect the quality value of laser cutting processing; a controller for repeatedly performing first test cutting processing on the processing target in multiple implementation rounds by driving the processing machine by selectively using any one of the set values for testing as the set value of the processing parameters according to a predetermined order; and an analysis module for analyzing each of results of the first test cutting processing and individually measuring the quality value of each of the results of the first test cutting processing, and selecting, among the set values for testing, a set value for testing used in a specific implementation round of the first test cutting processing, at which the quality value that most satisfies predetermined reference quality is measured, as a set value for mass production of the processing parameters.

A method for welding components includes the following steps: providing a first component and a second component; bringing together the two components; welding the two components by use of a laser beam, wherein a plurality of welding impulses are generated through the repeated activation and deactivation of the laser beam, with each welding pulse being interrupted by welding-free rest intervals in which the laser beam is deactivated, wherein a local welding area is generated by each welding pulse, in which material of the two components is melted and fused in a locally limited manner, wherein individual welding areas of those generated by the welding pulses overlap.

A method for welding components includes the following steps: providing a first component and a second component; bringing together the two components; welding the two components by use of a laser beam, wherein a plurality of welding impulses are generated through the repeated activation and deactivation of the laser beam, with each welding pulse being interrupted by welding-free rest intervals in which the laser beam is deactivated, wherein a local welding area is generated by each welding pulse, in which material of the two components is melted and fused in a locally limited manner, wherein individual welding areas of those generated by the welding pulses overlap.

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator, a condenser lens that condenses a laser beam emitted from the laser oscillator, and a phase modulation element arranged between the laser oscillator and the condenser lens. Individual differences of the condenser lens are prevented by applying, to the phase modulation element, voltages corresponding to a combined pattern of a shape correction pattern which is configured to correct differences between an actual shape and design values of the condenser lens, and an adjustment pattern which is configured to adjust optical characteristics of the laser beam at each processing point.

A laser processing method comprises generating a laser beam comprising laser pulses having a duration less than 1000 ps, focussing the laser beam to form a focal region inside a transparent material and varying the position of at least one of the focal region and the transparent material so as to provide a pulse-to-pulse overlap of between 45% and 99%, thereby to form a smooth material modification inside the transparent material.

A laser processor includes a laser oscillator housed in a closed housing, an oscillator controller that controls the laser oscillator and is supplied with electric power by a first primary power supply, a dehumidifier that is housed in the closed housing and operates using electric power supplied from a second primary power supply, and a dehumidification controller that controls the dehumidifier and is supplied with electric power by the second primary power supply.

A laser processor includes a laser oscillator housed in a closed housing, an oscillator controller that controls the laser oscillator and is supplied with electric power by a first primary power supply, a dehumidifier that is housed in the closed housing and operates using electric power supplied from a second primary power supply, and a dehumidification controller that controls the dehumidifier and is supplied with electric power by the second primary power supply.