A method of removing contaminants from a surface of a gas turbine engine component protected by a diffusion coating that comprises an additive layer on the surface of the component and a diffusion zone in the surface of the component. The method includes subjecting the surface containing contaminants to laser beam pulses to remove contaminants from the component such that contaminants on the surface of the component are removed without damaging or removing the diffusion zone of the diffusion coating. Methods for controlled removal of at least a portion of a thickness of a diffusion coating from a coated superalloy component are also provided.

A double fibre laser cutting system for laser cutting sheet metal that comprises: a cutting machine with a mobile gantry and fixed metal sheets, multiple heads both for straight cutting and bevel cutting, multiple cutting sources in each head, automated means for changing the cutting source in each head, means for controlling all the elements, wherein the multiple cutting sources in each head is carried out by means of two fibres sent from corresponding generator outlets to each head. The simultaneous cutting of one or more metal sheets with different thicknesses is achieved and, consequently, maximum laser cutting capacity in useful length, and in useful width, the use of a single generator, and the automatic adjustment of cutting conditions in accordance with the thicknesses, straight and bevel cutting simultaneously in multiple heads.

A housing for an electronic device including a marking comprising multiple pixels is disclosed herein. The housing comprises one or more oxide layer, such as a metal oxide layer, and the marking comprises pixels formed into or within the oxide layer. In some instances, the pixels cooperate to form an image along an exterior surface of the electronic device.

A processing apparatus includes a controller configured to control an operation of forming condensing points in a processing target object. In forming the condensing points by radiating a laser light to an inside of the processing target object periodically from a modifying device while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by a moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in a plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.

A processing apparatus includes a controller configured to control an operation of forming condensing points in a processing target object. In forming the condensing points by radiating a laser light to an inside of the processing target object periodically from a modifying device while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by a moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in a plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.

A method of assembling a substrate with a part is provided. The method includes a step of structuring the substrate by a pulsed laser. In one example, the substrate is metallic and the part is polymer-based. The structuring step engraves grooves into the substrate in a pattern determined by the relative motion of the beam and the substrate. The pattern is configured to provide improved adhesion between the structured substrate and a part after assembling the substrate and the part by laser welding. The method of assembling may further include a pre-treatment step of the structured surface to allow improve laser absorption during the welding assembling.

A method for processing a mortise of a small-size superalloy turbine disk using laser shock peening A laser shock peening (LSP) parameter of a laser shock peening (LSP) robot is designed. A spatial data of a motion trajectory of the LSP robot for a laser shock peening area of mortise teeth of the first mortise is found and recorded using a robot simulation system software to generate a trajectory program of the robot for the first mortise. Then a rotation program of an end of an arm of the LSP robot is written according to an included angle between two adjacent mortises to generate a trajectory program of the robot for all mortises of the turbine disk. Finally, the turbine disk is processed by laser shock peening.

A laser control device includes a processor configured to control, when a control circuit of a laser device detects occurrence of an abnormality in a laser oscillator or a laser optical system and stops laser output from the laser oscillator, the control circuit based on a result of determining whether to enable or disable re-outputting of laser light from the laser oscillator by inputting, to a classifier, input data being at least a part of environmental data and state data about the laser device in a predetermined period including a stop time of laser output. Then, the state data and the input data in the predetermined period include at least one of time-series data about a light amount of laser light and time-series data about a light amount of return light propagating in a direction opposite to a direction of the laser light in the predetermined period.

A laser control device includes a processor configured to control, when a control circuit of a laser device detects occurrence of an abnormality in a laser oscillator or a laser optical system and stops laser output from the laser oscillator, the control circuit based on a result of determining whether to enable or disable re-outputting of laser light from the laser oscillator by inputting, to a classifier, input data being at least a part of environmental data and state data about the laser device in a predetermined period including a stop time of laser output. Then, the state data and the input data in the predetermined period include at least one of time-series data about a light amount of laser light and time-series data about a light amount of return light propagating in a direction opposite to a direction of the laser light in the predetermined period.

In a method for manufacturing a light-emitting element, a second irradiation process includes forming a first modified region at a first distance from a second surface in a thickness direction of a sapphire substrate, forming a second modified region at a second distance from the second surface in the thickness direction, the second distance being less than the first distance, the second modified region being shifted in a first direction from the first modified region, and forming a third modified region at a third distance from the second surface in the thickness direction, the third distance being less than the second distance, the third modified region overlapping the first modified region in a top-view. In the thickness direction of the sapphire substrate, a greater number of modified regions that include second modified portions are formed than modified regions that include first modified portions.