In a method for manufacturing a light-emitting element, a second irradiation process includes forming a first modified region at a first distance from a second surface in a thickness direction of a sapphire substrate, forming a second modified region at a second distance from the second surface in the thickness direction, the second distance being less than the first distance, the second modified region being shifted in a first direction from the first modified region, and forming a third modified region at a third distance from the second surface in the thickness direction, the third distance being less than the second distance, the third modified region overlapping the first modified region in a top-view. In the thickness direction of the sapphire substrate, a greater number of modified regions that include second modified portions are formed than modified regions that include first modified portions.

A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.

A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.

A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90).

Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90).

Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

Detectors are situated along a tilted optical axis to receive optical radiation from a work surface. Variations in the received optical power are used to estimate a work surface positional along a work surface axis. The received optical power can be emitted from the work surface and an estimated temperature of the work surface used to adjust the received optical power. One or two single element detectors or a linear detector can be used. A position of a focused spot produced from the received optical power at the linear detector can be used to assess work surface axial position.

Detectors are situated along a tilted optical axis to receive optical radiation from a work surface. Variations in the received optical power are used to estimate a work surface positional along a work surface axis. The received optical power can be emitted from the work surface and an estimated temperature of the work surface used to adjust the received optical power. One or two single element detectors or a linear detector can be used. A position of a focused spot produced from the received optical power at the linear detector can be used to assess work surface axial position.

Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +1-5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

Angled, single laser weld and a method of forming an angled, single laser weld including arranging a first and second faying surfaces of a first and second component adjacently to form an interface between the components; irradiating at least one of the first and second components at the interface with a laser, wherein the first faying surface defines a plane formed at an angle alpha in the range of +1-5 degrees to 60 degrees from an axis A perpendicular to the first front surface and the second faying surface matches the first faying surface; and forming a junction at the interface with an hourglass shaped weld.

Systems and methods for static and dynamic calibration may be used to provide alignment of a measurement beam from a coherence imaging (CI) measurement system relative to a processing beam from a material processing system. In these systems and methods, a calibration measurement output may be obtained from the CI measurement system and/or from an auxiliary sensor. Future measurements performed by the CI measurement system may be modified based on, at least in part, the calibration measurement output.