A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.

Method for creating an iridescent visual effect on the surface of a part, using a laser beam having a pulse duration of less than a nanosecond sent onto said surface in the optical field of the focusing system of a device comprising also a laser source and a scanner, to apply wavelets having the same orientation to said surface over the pulse width. The scanner scans the surface using laser radiation along a series of consecutive lines, or a matrix of points using relative movement of said surface and the device, the width of each line or the dimension of each point of each matrix being equal to the pulse diameter. Between the carrying out of the scanning along two consecutive lines or two adjacent points the polarization of the laser beam is modified to create wavelets having different orientations on two consecutive lines or two adjacent points.

The present invention relates to a three-dimensional printing apparatus using a digital light processing (DLP) projector with a laser scanner, the apparatus comprising: a resin storage unit storing a photocurable resin; a DLP projector unit projecting light to the resin storage unit; a molding stage unit provided to be capable of being lifted and lowered in a vertical direction from a bottom of the resin storage unit; a laser scanner unit performing scanning of light for the resin storage unit; a scanner transfer unit allowing the laser scanner unit to move in an x-axis direction; an image processing unit dividing one sectional image of a sculpture into a core portion and a shell portion; and a controller receiving data on the core portion and the shell portion from the image processing unit, controlling the DLP projector, the laser scanner unit, the scanner transfer unit, and the molding stage unit.

The present invention is related to a heating device for heating an object material using a laser beam, the heating device comprising a stage on which the object material is placed; a laser module for generating and outputting a laser beam; an optical module for controlling a path of the laser beam; a polygon mirror rotating around an axis of rotation and having a plurality of reflecting surfaces which reflect the laser beam; and a beam guide module for controlling an incidence range within which the laser beam reflected by the polygon mirror is incident on the object material, and an indirect heating method using a laser beam in a heating device.

A groove processing device (100) that forms a groove in a surface of an object using laser beams (LB) includes: a light source device (11) that outputs the laser beams (LB); a polygon mirror (10) that reflects the laser beams output from the light source device (11); a condensing optical system that is provided on an optical path of the laser beams (LB) reflected by the polygon mirror (11) and focuses the laser beams (LB); and a shielding plate (35) that is provided between the condensing optical system and the object at a position which blocks some of the laser beams (LB) focused through the condensing optical system and blocks some of the laser beams (LB). Among the laser beams (LB) focused through the condensing optical system, some of the laser beams (LB) that are not blocked by the shielding plate (35) form the groove in the surface of the object at a focus of the laser beams (LB). The shielding plate (35) is provided closer to the condensing optical system than the focus and is rotated with respect to the surface of the object so as to block the laser beams (LB) that do not form the groove.

A groove processing device (100) that forms a groove in a surface of an object using a laser beam includes: a light source device (11) that outputs the laser beam; a polygon mirror (10) that reflects the laser beam output from the light source device (11); and an optical system that is provided on an optical path of the laser beam reflected from the polygon mirror (10) and includes a condensing portion (13A) which transmits the laser beam reflected from one surface of the polygon mirror (10) so as to be focused on the surface of the object and a non-condensing portion (13B) which is provided outside the condensing portion (13A) and transmits the laser beam reflected from a corner portion, in which two adjacent surfaces of the polygon mirror (10) meet, so as not to be focused on the surface of the object.

The present invention relates to a process for irradiating a processed surface (5) of a processed substrate (1) so as to obtain a predefined temperature profile, the processed surface (5) comprising a first area (11) and a second area (13), said first area (11) having a first combination of optical properties and thermal properties, and said second area (13) having a second combination of optical properties and thermal properties, said first combination and second combination being different. A further object of the invention is a system (21) for irradiating a processed surface (5) of a processed substrate (1) so as to obtain a predefined temperature profile, the processed surface (5) comprising a first area (11) and a second area (13), said first area (11) having a first combination of optical properties and thermal properties, and said second area (13) having a second combination of optical properties and thermal properties, said first combination and second combination being different.

A method for creating an iridescent effect on a surface through formation of wavelets on the source can include using a pulse of laser beams sent to the surface in juxtaposed optical fields of a focusing system. A scanner scans the surface using laser beams along a series of lines that follow each other in a relative direction of travel of the part and of the scanner and a series of lines that lie in continuation of each other in a direction perpendicular to the relative direction of travel. The optical fields overlap in an overlapping area having a width that is twice the diameter of the pulse laser beam up to 2 cm. Two lines lying in continuation of each other overlap at a junction and between the two series of lines follow each other in a relative direction of travel of the part and the scanner.

Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.

In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.