B23K26/0821

Laser processing apparatus
11090766 · 2021-08-17 · ·

A laser processing apparatus for processing a wafer along projected dicing lines with a laser beam has a laser oscillator, a polygon mirror having a plurality of reflecting surfaces and rotatable about a central axis thereof, and an fθ lens for focusing the beam reflected by the reflecting surfaces of the polygon mirror and applying the focused beam to the wafer. The reflecting surfaces of the polygon mirror include a zero-gradient reflecting surface lying at a zero gradient parallel to the central axis, a positive-gradient reflecting surface that is inclined at a positive gradient from the zero gradient, and a negative-gradient reflecting surface that is inclined at a negative gradient from the zero gradient. The polygon mirror swings the laser beam in a direction perpendicular to a processing feed direction within the width of each of the projected dicing lines and in the processing feed direction.

Additive manufacturing with polygon and galvo mirror scanners

An additive manufacturing system includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, a light source to generate a first light beam and a second light beam, a polygon mirror scanner, a galvo mirror scanner positioned adjacent to the polygon mirror scanner, and a controller. The controller is coupled to the light source, the polygon mirror scanner and the galvo mirror scanner, and the controller is configured to cause the light source and polygon mirror scanner to apply the first light beam to a region of the layer of feed material, and to cause the light source and galvo mirror scanner to apply the second light beam to at least a portion of the region of the layer of feed material.

Laser processing apparatus

A laser beam applying unit of a laser processing apparatus includes a laser oscillator, a condenser adapted to focus the laser beam emitted from the laser oscillator and apply the laser beam to a workpiece, and a liquid jetting apparatus disposed at a lower end portion of the condenser and adapted to jet a liquid to an upper surface of the workpiece. The liquid jetting apparatus includes: a transparent plate disposed at the lower end portion of the condenser and permitting transmission therethrough of the laser beam; a casing provided with a space defined by a ceiling wall composed of the transparent plate, side walls, and a bottom wall; an opening formed in the bottom plate, extending in a processing feeding direction, and permitting passage therethrough of the laser beam focused by the condenser; and a liquid supply section adapted to supply the liquid to the casing.

ADDITIVE MANUFACTURING SYSTEMS AND RELATED METHODS UTILIZING OPTICAL PHASED ARRAY BEAM STEERING
20210252640 · 2021-08-19 · ·

Methods and systems for additive manufacturing are described. In one embodiment, laser energy is emitted from one or more laser energy sources, and a phase of the laser energy emitted by each of the laser energy sources is controlled to at least partially control a position of one or more laser beams directed towards a build surface. In some embodiments an optical phased array (OPA) is used to at least partially control the position and/or shape of the one or more laser beams on the build surface. Additionally, in some embodiments one or more mirror galvanometers and/or a moveable portion of a system may be used in coordination with one or more OPA assemblies.

SUBSTRATE PERFORATION SYSTEM & METHOD USING BEAMLETS

A perforation system is disclosed that utilizes an optical beamlet generator and a scanner (e.g., at least two moveable mirrors). The optical beamlet generator may be a lenslet array or a diffractive optical element. The optical beamlet generator outputs a plurality of beamlets from a single input laser beam. These beamlets are moved in at least two dimensions relative to a surface of a substrate to form perforations in the substrate.

SUBSTRATE PERFORATION SYSTEM & METHOD USING POLYGON MIRROR(S)

Various arrangements and methods are disclosed for forming one or more perforations on a substrate surface using a laser system, at least one rotating polygon mirror, and at least one other movable mirror. A rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate surface by incrementing (e.g., moving) a first mirror between a plurality of fixed (e.g., pointing) positions. A rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate using a first mirror that is maintained in a fixed (e.g., pointing) position. A first rotating polygon mirror and a second rotating polygon mirror may be used to define a plurality of perforations in a row set or band on a substrate surface, where the first and second polygon mirrors are used to define an extent of a given perforation in two dimensions on the substrate.

LAMINATION MOLDING APPARATUS

An irradiation device of a lamination molding apparatus includes: at least one laser source, generating a laser beam; a first galvano scanner, scanning the laser beam; a second galvano scanner, scanning the laser beam; and an irradiation controller, controlling the laser source, the first galvano scanner, and the second galvano scanner. Irradiable ranges of the laser beams by using the first galvano scanner and the second galvano scanner respectively include an entire of a molding region. A first X-axis galvano mirror and a first Y-axis galvano mirror of the first galvano scanner and a second X-axis galvano mirror and a second Y-axis galvano mirror of the second galvano scanner are disposed to be plane-symmetric to each other.

DEVICE AND METHOD FOR LASER-ASSISTED MACHINING OF BODIES OR SURFACES
20210162540 · 2021-06-03 ·

A device for the laser-assisted processing of a material adhering to a substrate or a body that is associated with, or free of, a substrate or of its surface, in particular by TPA/MPA and/or by treatment with an ultrashort pulse laser. A sample holder of a positioning system holds the material to be processed. A laser source emits laser pulses or laser pulse sequences. Focusing optics shape the laser pulses or laser pulse sequences to impinge in a focal point or a focal volume in the region of the material or body to be processed so that a 2- or multi-photon polymerization can take place there, or in that they impinge in a focal point or in a focal volume in the region of the body in such a way that material located there or focal volume is subjected to the desired chemical and/or physical changes.

Control device and method for controlling the laser beam deflection
11014193 · 2021-05-25 · ·

A method and a control device for deflection of a laser beam for laser-based additive manufacturing processes includes first and second orthogonally rotatable mirrors designed to reflect the laser beam and guide the laser beam to an irradiation field. The first mirror and the second mirror are secured on respective first and second shafts, with the first mirror performing a continuous first vibration with a first frequency, and the second mirror performing a continuous second vibration with a second frequency different from the first frequency and/or with a phase difference with respect to the first vibration. Each of the two shafts has a known position such that the first vibration is synchronous with the second vibration. The laser is activated/deactivated upon reaching/leaving an irradiation point. The generated vibrations of the mirrors describe a continuous Lissajous curve.

LINE-SHAPE SPOT LASER BENDING METHOD FOR METAL SHEETS
20210162479 · 2021-06-03 ·

The present invention belongs to the technical field of high-efficiency, high-precision and high-performance laser bending of metal sheets, and relates to a line-shape spot laser bending method for metal sheets. The present invention uses a multimode laser scanning mirror or a single piezoelectric deformable mirror to convert laser Gaussian distributed point spots to uniformly distributed line-shape spot, and meanwhile, loads the spots in a bending line area and bends metal sheets so that the temperature field in the bending line of the metal sheet is distributed uniformly to achieve the purposes of reducing warpage deformation, enhancing bending angle consistency and increasing the bending efficiency.