In an embodiment, a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer is provided. The method includes detecting the mask layer by a sensor, the mask layer providing a substrate surface; determining a property of the blind via, the property comprising one or more of a top diameter, a bottom diameter, a volume, or a taper angle; focusing a Gaussian laser beam, under laser process parameters, at the substrate surface to remove at least a portion of the mask layer; adjusting the laser process parameters based on the property; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. The mask layer can be pre-etched. Apparatus for forming a blind via in a substrate are also provided.

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.

A laser marking apparatus includes a head marking the identifier on a mold, a light-shielding case, a light-shielding gate provided at either a carrying-in port or a carrying-out port of the light-shielding case, and a control unit controlling operation of the head and operation of the light-shielding gate, and the control unit closes the light-shielding gate and causes the head to start a marking operation on the mold in response to carrying-in of the mold into the operation space and opens the light-shielding gate in response to the marking operation ending.

The present disclosure provides an additive production method of producing an object by metal powder being applied in a production region in layers by an application device. The metal powder is applied to a base member along a construction face and is partially molten by a laser beam and solidified. A continuous conveyor transports the base member with the object in a transport direction away from the construction face. The continuous conveyor further transports the base member with the completed object to a removal region where the object is removed from the continuous conveyor. Support structures are produced on the object and are connected to the base member. The support structures are removed after the removal region has been reached.

A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.

In the method for cleaning optical components by UV ashing according to the present embodiment, while supplying humidity-controlled humidified gas, ultraviolet rays are radiated to the surface of the protective glass to remove organic matters on the surface of the protective glass. Further, in the cleaning method of the present embodiment, the humidified gas is supplied so that the humidity in the laser head during cleaning becomes 30% to 90%.

The present disclosure relates to a laser cutting system including a processing machine provided to perform laser cutting on a processing target using a laser beam according to a predetermined processing design to divide the processing target to form a product having a shape corresponding to the processing design; a setting module for preparing, according to predetermined processing conditions, a process recipe including a plurality of set values for testing of processing parameters that affect the quality value of laser cutting processing; a controller for repeatedly performing first test cutting processing on the processing target in multiple implementation rounds by driving the processing machine by selectively using any one of the set values for testing as the set value of the processing parameters according to a predetermined order; and an analysis module for analyzing each of results of the first test cutting processing and individually measuring the quality value of each of the results of the first test cutting processing, and selecting, among the set values for testing, a set value for testing used in a specific implementation round of the first test cutting processing, at which the quality value that most satisfies predetermined reference quality is measured, as a set value for mass production of the processing parameters.

A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.

An apparatus, and associated method, laser cuts self-wrapping, woven or braided split sleeves from a continuous feed of sleeve material by sweeping a laser beam across the continuously fed material. Instead of sweeping the laser beam straight across the material in a direction perpendicular to the longitudinal axis of the material, the sweep path is angled to follow the feed rate of the material while the laser beam cuts through the material from one side to the other. Thus, a straight cut may be completed without stopping the feed. The apparatus includes a mandrel tor expanding the material before intersection with the laser beam to open a gap at the longitudinal split. The mandrel has a wedge-shaped tip with an end-surface profile that is at an oblique angle to the direction of motion of the material. The oblique angle at least approximately matches the sweep angle of the laser beam.