In a laser cutting machine for cutting a sheet of material, a laser scanner (12) is traversable in a lateral direction across a cutting surface (14). The laser scanner is controllable to direct a laser beam onto the cutting surface within a cutting area (A) of the cutting surface. A material-advancing mechanism is provided that is controllable to incrementally advance the sheet of material in a longitudinal direction over the cutting surface. In use, the material-advancing mechanism is controllable to position and hold stationary successive laterally- extending portions of the material in the cutting area. The laser scanner is controllable to cut each successive laterally-extending portion of the material held stationary in the cutting area before the material is advanced.

A negative electrode for an electrochemical cell of a lithium metal battery may be manufactured by joining together a metallic current collector piece and a lithium metal piece. The metallic current collector piece may be positioned adjacent the lithium metal piece in an at least partially lapped configuration at a weld site. A laser beam may be directed at an upper surface of the metallic current collector piece at the weld site to melt a portion of the lithium metal piece adjacent the metallic current collector piece and produce a lithium metal molten weld pool. The second laser beam may be terminated to solidify the lithium metal molten weld pool into a solid weld joint that physically bonds the lithium metal piece and the metallic current collector piece together at the weld site.

A wafer producing apparatus includes: an ingot grinding unit configured to grind and planarize an upper surface of an ingot held by a first holding table; a laser applying unit configured to apply a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be produced from an upper surface of the ingot held by a second holding table, to form a peel-off layer; a wafer peeling unit configured to hold the upper surface of the ingot held by a third holding table and peel off the wafer from the peel-off layer; and a carrying tray having an ingot support section configured to support the ingot and a wafer support section configured to support the wafer.

A laser processing apparatus 3 includes: a laser head H; a conveying device 4 that conveys a workpiece W; a head driving mechanism that moves the laser head H; a dust collecting box 60 that moves below the workpiece W and follows the laser head H such that the dust collecting box 60 is disposed below the laser head H; an outer support roller 81 and an inner support roller 82 that are provided at an opening 61 of the dust collecting boz 60 and are rotatable around an axis parallel to a width direction orthogonal to a conveying direction Fy; and a counter roller 9 that rotates the outer support roller 81 in synchronization with a conveying operation of the workpiece W by the conveying device 4. The counter roller 9 transmits motive power of the conveying device 4 as a belt conveyor to the outer support roller 81.

A laser marker device (11) includes: a free running counter (16) configured to output a free count value (Cf) obtained by counting the number of pulses of a pulse signal; a FIFO memory (15) configured to sequentially store the free count value as a trigger timing count value every time a trigger signal (tr) is output from a trigger sensor (13); a printing control unit (17, 18) configured to sequentially read out the trigger timing count value from the memory in order of storage, recognize a position of a workpiece to be printed next, and perform printing processing with respect to the workpiece if the workpiece is conveyed to the printing position.

A conveyor belt assembly (10) for transporting single sheets or stacks of a packaging material is described. It comprises at least one conveyor belt (12a) being arranged over at least two pulleys (20a-20d), wherein at least one of the pulleys (20a-20d) is adapted to drive the conveyor belt (12a) in a conveying direction (15). Furthermore, the conveyor belt assembly (10) comprises a conveying section (22) adapted for transporting the sheets or stacks and a return section (24) adapted to return the conveyor belt (12a) from an end (22b) of the conveying section (22) to a beginning (22a) of the conveying section (22). The conveying section (22) is equipped with a middle section (26), in which the conveyor belt (12a) is arranged in a substantially flat manner, and at least one transition section (28) arranged between the middle section (26) and the respective pulley (20a-20d), with the conveyor belt (12a) being arranged in the transition section (28) in a retracted position with respect to a plane (26a) defined by the middle section (26).

A laser processing method for a long film is disclosed which has high productivity. A laser processing method according to the present invention includes a process of cutting a long film F by irradiating the long film F with a laser beam L while scanning the laser beam L by a deflecting operation of a galvanometer scanner 13 and while continuously conveying the long film F in the longitudinal direction. The control device 3 controls the deflecting operation of the galvanometer scanner 13 based on a desired cutting shape of the long film F set in advance and a conveying speed of the long film F that is calculated using a rotary encoder 2.

A system includes a laser configured to conduct a cleaning cycle that includes producing a laser beam capable of cleaning a faying surface of each of a plurality of nutplates, and conducting a first pass to clean each of the faying surfaces, wherein the laser is at a first position having a first angle relative to an axis orthogonal to the faying surfaces during the first pass. The system also includes a nutplate tray configured to hold the plurality of nutplates such that each faying surface is oriented such that the laser beam is capable of contacting each faying surface at least once during the cleaning cycle.

Disclosed embodiments describe a reconstructed filament comprising natural protein fibrils and an additive. Disclosed embodiments also describe a wool comprising: a plurality of staple fibers formed of reconstructed filaments, wherein the reconstructed filaments comprise natural protein fibrils and an additive. Disclosed embodiments also describe a yarn spun from staple fibers, the yarn comprising: staple fibers comprising reconstructed filament, wherein the reconstructed filament comprises natural protein fibrils and an additive. Disclosed embodiments also describe an item comprising a reconstructed filament, wherein the reconstructed filament comprises natural protein fibrils and an additive.

A wafer producing apparatus includes an ingot grinding unit that grinds the upper surface of an ingot to planarize the upper surface, a laser irradiation unit that positions the focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to the thickness of a wafer to be produced from the upper surface of the ingot and irradiates the ingot with the laser beam to form a separation layer, a wafer separating unit that separates the wafer from the ingot, and a tray having a support part that supports the separated wafer.