A laser processing apparatus (1) according to an embodiment includes a processing chamber (18) configured to perform laser processing for an object to be processed (40), a stage (10) disposed inside the processing chamber (18), the stage being configured to convey the object to be processed (40), and a control unit (50) configured to instruct a loading/unloading apparatus (30) about a placement position of the object to be processed (40) over the stage (10), the loading/unloading apparatus (30) being configured to load/unload the object to be processed (40) into/from the processing chamber (18). Further, the processing chamber (18) includes a loading gate (17a) for loading and an unloading gate (17b) for unloading for the object to be processed (40), and the object to be processed (40) is conveyed only in a first direction from the loading gate (17a) toward the unloading gate (17b) over the stage (10).

A laser processing apparatus 1 includes a laser head 31, a flexible cable 6 connecting a laser oscillator and the laser head 31 to each other, a conveyance apparatus 2 that conveys a workpiece W, a head drive mechanism 5 that moves the laser head 31 to a processing position, and a cable support mechanism 7 that moves the cable 6 in association with movement of the laser head 31. The cable support mechanism 7 includes a first holder 61 holding the cable 6, a first spring balancer 711 connected to the first holder 61 through a first wire 712, and a second spring balancer 721 connected to the first holder 61 through a second wire 722. The spring balancers 711, 721 are fixed to a support frame 8, and as viewed in plane, are arranged in a line along a width direction X perpendicular to a conveyance direction Y.

A laser processing apparatus 3 includes: a laser head H; a conveying device 4 that conveys a workpiece W; a head driving mechanism that moves the laser head H; a dust collecting box 60 that moves below the workpiece W and follows the laser head H such that the dust collecting box 60 is disposed below the laser head H; an outer support roller 81 and an inner support roller 82 that are provided at an opening 61 of the dust collecting box 60 and are rotatable around an axis parallel to a width direction orthogonal to a conveying direction Fy; and a counter roller 9 that rotates the outer support roller 81 in synchronization with a conveying operation of the workpiece W by the conveying device 4. The counter roller 9 transmits motive power of the conveying device 4 as a belt conveyor to the outer support roller 81.

A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.

A process of producing optical devices is provided including transferring a first substrate comprising one or more devices to a laser dicing tool, the laser dicing tool including a filamentation stage and a singulation stage. One or more device contours are created on the first substrate in the filamentation stage. The optical devices are singulated from the first substrate along the one or more device contours in the singulation stage. The devices are transferred to storage or for further backend processing.

A stage for cutting process and cutting method thereof, processing apparatus are disclosed. The stage includes a support substrate and a driving unit disposed on the support substrate. The driving unit is configured to drive the support substrate to rotate around a first direction in a board surface of the support substrate so as to remove foreign matters on the support substrate. The driving unit disposed in the stage can drive the rotation of the stage to allow foreign matters on the stage to automatically slide down.

A method and apparatus for laser or plasma cutting of pieces from laminar material wound in coil is provided. The apparatus provides a cutting station, with an operative cutting area and a receiving cavity, means for positioning and holding the laminar material suspended in the operative area above the receiving cavity during cutting operations, an electronic control unit and movable device for selective collection of the machined pieces. The electronic control unit controls the movement of the movable device between an active and a passive position so that that the movable device is in passive position when the cutting head is performing cutting operations generating swarf, letting such swarf to fall inside the cavity, and is in active position when the cutting head is performing cutting operations to detach pieces from the laminar material skeleton, to collect the pieces separately from the swarf and the skeleton.

A method for processing cardboard includes the steps of irradiating a surface of a cardboard blank with a first laser in order to remove material from the cardboard blank according to a first pattern. The first laser is irradiated with a first laser power and with a laser beam thereof being scanned with a first scanning speed. The first laser power is greater than or equal to 0.5 kW. The first scanning speed is greater than or equal to 2000 mm/s and less than or equal to 25000 mm/s. The method also includes the step of irradiating the surface of the cardboard blank with the first laser in order to remove material from the cardboard blank according to the first pattern and is carried out while the cardboard blank is being conveyed.

A method and apparatus are disclosed with a continuous straw forming process for spiral winding boron-coated foil into a rounded tube or cylinder with an overlap and tight contact between the spiral edges, and a welding process utilizing a high precision fiber laser to weld the spiral seem forming a straw tube.

A plate-like workpiece having a transparent, glass, glass-like, ceramic and/or crystalline layer, such as for use in an electronic display screen, is processed into separate segments by first incompletely severing the workpiece along outer contours of bounded segments, by forming holes through the layer with a laser beam, leaving the segments interconnected at narrow connections, and then separating the segments by severing the web-like connections.