A method of processing a wafer having a plurality of devices provided in respective areas demarcated on a face side of the wafer by a plurality of projected dicing lines. The method includes coating the face side with a protective film agent and thereafter drying the protective film agent into a protective film covering the face side, applying a laser beam having a wavelength absorbable by the wafer to the wafer along the projected dicing lines on the face side, thereby producing a plurality of laser-processed slots in the wafer, cleaning away the protective film, applying ultraviolet rays to the face side to remove an organic substance deriving from the protective film and remaining on the face side, and covering coverage areas corresponding to the respective devices on the face side with an encapsulating resin.

A processing system is a processing system that is configured to process an object by irradiating the object with an energy beam, and includes: a placing apparatus on which the object is placed; an irradiation apparatus that is configured to irradiate the object with the energy beam; and a light reception apparatus that includes: a beam passing member having an attenuation area in which the energy beam is attenuated and a plurality of passing areas through each of which the energy beam is allowed to pass; and a light reception part that is configured to optically receive the energy beam that has passed through the plurality of passing areas.

A method using femtosecond laser for nano precision preparation. Initial damage nanoholes formed by using femtosecond laser multiphoton excitation are used as a seed structure, and the energy and polarization state of subsequent laser pulses are adjusted in real time, such that uniform and directional optical near-field enhancement is generated near the seed structure and finally the high-precision removal of machined materials is realized. Benefiting from the high localization of near-field spot energy in space, the method uses femtosecond laser pulses having the wavelength of 800 nm to achieve a machining accuracy having the minimum linewidth of only 18 nm, and the linewidth resolution reaches 1/40 of the wavelength; and the method using femtosecond laser for nano precision preparation does not need a vacuum environment, having good air/solution machining compatibility.

In an example method, a laser processing head is moved from an entrance region over a workpiece to a starting position above the workpiece. During this time, a distance control system is used to control the distance between the laser processing head and the workpiece based on measurements obtained from one or more distance sensors. Further, the laser processing head is moved from the starting position to a position beyond an edge of the workpiece. During this time, the distance control system is disengaged. When the laser processing head reaches the position beyond an edge of the workpiece, laser emission is initiated, and the laser processing head is moved back towards the starting position. Upon reaching the starting position, the distance control system is reengaged. The laser processing head is subsequently moved along a pre-determined path to cut the workpiece.

This laser processing machine, which moves a work piece, which is mounted on a table, and an optical head, which shines a laser light, relative to each other, and processes the work piece by irradiating the work piece with the laser light, is provided with: a calibration camera that is fixed to the optical head; a probe that is fixed to the optical head; and a calibration unit that has measurement reference points (Pc1, Pc2, Pc3, Pp1, Pp2, Pp3) for measuring the position of the calibration camera and the probe, and a processing portion that forms a processing mark (L1, L2) due to the laser light.

It is an object of the present invention to improve visibility for observation with naked eyes or for camera shooting without spoiling the appearance during marking inside a. transparent medium using a laser. By irradiating an inside of a transparent medium with a laser, the present invention forms a micro-denatured region in each of a first layer and a second layer inside the medium. The micro-denatured regions in the respective layers are arranged out of alignment with each other on a two-dimensional plane (refer to FIG. 1).

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.

There is provided an optical axis adjustment jig including a flat parallel-surface plate having an upper surface and a lower surface with reflective films disposed respectively thereon, and an image capturing unit disposed beneath the flat parallel-surface plate for capturing an image of a laser beam applied thereto. The flat parallel-surface plate is made of a material that is transmissive of a wavelength of the laser beam. The laser beam is applied through the flat parallel-surface plate to the image capturing unit. A tilt of the optical axis of the laser beam is detected on the basis of the shape of the beam spot of the laser beam whose image has been captured by the image capturing unit.

A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.