A boring device includes: a rotatable body, which has a workpiece holder, a valve seat receiver and a debris passage portion; a laser emitter; a pump and a control unit. The workpiece holder can hold a nozzle body. The valve seat receiver contacts a valve seat of the nozzle body that is held by the workpiece holder. The laser emitter emits a laser beam to an outer wall of the nozzle body to bore injection holes at the nozzle body. The debris passage portion includes a debris passage that is placed on a radially inner side of the valve seat receiver and guides debris formed at the time of boring the injection holes with the laser beam. The pump vacuums the debris through the debris passage. The control unit controls a laser output power of the laser emitter and a suction force of the pump.

The invention provides a multi-segment focusing lens for effective laser processing method that allows to cut/scribe/cleave/dice or, generally speaking, separate, hard, brittle, and solid wafers or glass sheets, which are either bare or have microelectronic or MEMS devices formed on them. The multi-segment focusing lens is used in a laser processing method comprises a step of modifying a pulsed laser beam by a shaping and focusing unit, including a multi-segment lens. Said multi-segment lens creates multiple beam convergence zones, more particularly, multiple focal points, said and interference spike shape intensity distribution exceeding the optical damage threshold of the workpiece material. Said interference spike shape intensity distribution is situated in the bulk of the workpiece. During the aforementioned step a modified area is created. The laser processing method further comprises a step of creating a number of such damage structures in a predetermined breaking line or curved trajectory by relative translation of the workpiece in relation to the focal point of the laser beam.

A lift-off method for transferring an optical device layer in an optical device wafer to a transfer substrate, the optical device layer being formed on the front side of an epitaxy substrate through a buffer layer. A transfer substrate is bonded through a bonding layer to the front side of the optical device layer of the optical device wafer, thereby forming a composite substrate. A pulsed laser beam having a wavelength transmissive to the epitaxy substrate and absorptive to the buffer layer is applied from the back side of the epitaxy substrate to the buffer layer, thereby breaking the buffer layer, and the epitaxy substrate is peeled from the optical device layer, thereby transferring the optical device layer to the transfer substrate. Ultrasonic vibration is applied to the composite substrate in transferring the optical device layer.

A wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot includes a separation start point forming step of setting the focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer, thus forming a separation start point. In the separation start point forming step, the laser beam is applied to the ingot plural times with the focal point of the laser beam set at the modified layer previously formed, thereby separating the cracks from the modified layer.

A wafer is produced from an ingot by confirming whether or not an inclined c-axis of the ingot and a second orientation flat of the ingot are perpendicular to each other, and detecting a processing feed direction perpendicular to the direction in which the c-axis is inclined. The method includes performing sampling irradiation of the ingot with a laser beam, along a direction parallel to the second orientation flat and a plurality of directions inclined clockwise and counterclockwise by respective predetermined angles from the second orientation flat, thereby forming a plurality of sampled reduced strength areas in the ingot; measuring the number of nodes which exist per unit length on each of the sampled reduced strength areas, and determining a direction in which the sampled reduced strength area where the measured number of nodes is zero extends as a processing feed direction.

A method of heating a portion of an object includes the steps of projecting an energy beam onto a surface of the object so as to produce a primary spot on the surface, and repetitively scanning the beam in two dimensions in accordance with a scanning pattern so as to establish an effective spot on the surface, and displacing the effective spot in relation to the surface of the object to progressively heat the at least one selected portion of the object. Displacing the effective spot in relation to the surface of the object includes displacing the effective spot following a track featuring at least one change of direction.

The effective spot is maintained aligned with the track by modifying operation of a scanner in correspondence with the at least one change of direction.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

A method is provided for producing a glass or glass ceramic article that includes: providing a sheet-like glass or glass ceramic substrate having two opposite faces, which in the visible spectral range from 380 nm to 780 nm exhibits light transmittance of at least 1% for visible light that passes from one face to the opposite face; providing an opaque coating on one face where the coating exhibits light transmittance of not more than 5% in the visible spectral range from 380 nm to 780 nm; and directing a pulsed laser beam onto the opaque coating and locally removing the coating by ablation down to the surface of the glass or glass ceramic article, repeatedly at different locations, thereby producing a pattern of a multitude of openings defining a perforated area in the opaque coating, so that the opaque coating becomes semi-transparent in the area.

Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

A method of dividing a single-crystal substrate along a plurality of preset division lines, includes a shield tunnel forming step of applying a pulsed laser beam having such a wavelength that permeates through the substrate along the division lines to form shield tunnels, each including a fine hole and an amorphous region shielding the fine hole, a protective member adhering step of adhering a protective member to the substrate before or after the shield tunnel forming step, and a grinding step of holding the protective member on the substrate, to which the shield tunnel forming step and the protective member adhering step are performed, on a chuck table of a grinding apparatus, grinding a reverse surface of the substrate to bring the substrate to a predetermined thickness, and dividing the substrate along the division lines along which the shield tunnels have been formed.