Patent classifications
B23K26/0876
Secondary battery
The present invention relates to a secondary battery capable of improving the coupling force between a safety vent and a cap-up. For example, disclosed is a secondary battery comprising: an electrode assembly; a case for accommodating the electrode assembly; a cap assembly coupled to the upper part of the case; and a gasket interposed between the cap assembly and the case, wherein the cap assembly includes a cap-up and a safety vent, which is provided at the lower part of the cap-up and has a vent extension part extending to the upper part of the cap-up so as to encompass the edge of the cap-up, a welding region, in which the safety vent and the cap-up are welded and coupled by laser welding, is formed in the vent extension part, and the welding region is formed in a line shape.
PROCESSING MACHINE
A processing machine includes: an external cover that forms an appearance of the processing machine and defines and forms an internal space; and a safety belt connection portion that is disposed in the internal space and to which a safety belt is connectable. The external cover includes an openable lid. The safety belt connection portion is exposed to an outside of the internal space through an opening that is generated in the external cover when the lid is in an open state.
INERT GAS-ASSISTED LASER MACHINING OF CERAMIC-CONTAINING ARTICLES
An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas, to minimize deleterious surface modifications and mitigate the oxide formation associated with laser machining.
Manufacturing method for joint body and manufacturing apparatus for joint body
A manufacturing method for a joint body having a first metal member and a second metal member joined together by causing a laser oscillation system to irradiate a surface of the second metal member placed on the first metal member with laser light to form a joint portion including a welded portion where the first metal member and the second metal member are joined together includes continuously supplying the second metal member while pressing the second metal member against the first metal member, the second metal member being a hoop material, and causing the laser oscillation system to emit the laser light.
Method of producing wafer
A method of producing a wafer from a hexagonal single-crystal ingot includes the steps of planarizing an end face of the hexagonal single-crystal ingot, forming a peel-off layer in the hexagonal single-crystal ingot by applying a pulsed laser beam whose wavelength is transmittable through the hexagonal single-crystal ingot while positioning a focal point of the pulsed laser beam in the hexagonal single-crystal ingot at a depth corresponding to a thickness of a wafer to be produced from the planarized end face of the hexagonal single-crystal ingot, recording a fabrication history on the planarized end face of the hexagonal single-crystal ingot by applying a pulsed laser beam to the hexagonal single-crystal ingot while positioning a focal point of the last-mentioned pulsed laser beam in a device-free area of the wafer to be produced.
Laser machining apparatus and laser machining method
A machining head emits a laser beam for cutting sheet metal of stainless steel. A moving mechanism moves the machining head relatively to a surface of the sheet metal. A beam vibrating mechanism vibrates a laser beam in a parallel direction with a cutting advancing direction of the sheet metal. In a machining condition database, a single specific vibration frequency at which cutting of the sheet metal is possible is set to a maximum moving velocity at which cutting of the sheet metal is possible, and a plurality of vibration frequencies from a maximum frequency to a minimum frequency at which cutting of the sheet metal is possible are set to a moving velocity more than or equal to a minimum moving velocity and less than the maximum moving velocity at which cutting of the sheet metal is possible.
SUBSTRATE PROCESSING STATION FOR LASER-BASED MACHINING OF SHEET-LIKE GLASS SUBSTRATES
A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.
Laser Fabrication with Beam Detection
A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.
Method for matching and tracking workpieces in laser etching operation
A method for matching and tracking workpieces in laser etching operation includes generating by the computer a label image that uniquely identifies the workpiece, moving a laser head to the workpiece, setting the laser head to a first power level by a power controller, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with a product image in a pixel wise fashion across the workpiece, moving the laser head to the label by the transport mechanism, setting the laser head to a second power level by the power controller, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in accordance with the label image in a pixel wise fashion across the label.
LASER MILLING AND REMOVAL TOOL AND METHODS
Systems and methods for cutting objects within a subterranean well include a laser system having a laser drilling head located at a terminal downhole end of a laser tool body directing a head laser beam in a direction downhole. A laser scanner assembly located within the laser tool body has a scanner head directing a scanner laser beam and can move both axially along a length of the laser tool body and rotate around a central axis of the laser tool body. A laser cutter assembly located within the laser tool body has a cutter head directing a cutter laser beam and can rotate around the central axis of the laser tool body. A cable bundle formed of a plurality of fiber optic cables extends from an uphole end of the laser tool body to each of the laser drilling head, the laser scanner assembly, and the laser cutter assembly.