The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.

A method for producing workpiece parts from a plate-shaped workpiece in a processing machine or laser processing machine includes positioning and holding the workpiece on a workpiece support by clamping devices. A plurality of workpiece parts are cut out of the workpiece with a process beam. The process beam is moved relative to the workpiece support by a processing head and/or the workpiece is moved relative to the workpiece support by the clamping devices. A cutting process for processing the workpiece to produce the workpiece parts is interrupted at least once by a relaxation step for the workpiece. During the relaxation step at least one clamping device is released to relax the workpiece. The at least one clamping device is closed following the relaxation and before continuing the cutting process. A data processing program and a processing machine for producing the workpiece parts are also provided.

A method includes applying laser pulses along a direction to a side of a wafer to create first and second stealth damage regions at respective first and second depths in the wafer and to create cracks that extend in the wafer from the respective stealth damage regions and that are spaced apart from one another along the direction, applying a compressive and retractive cyclical force to the wafer along the third direction to propagate and join the cracks from the respective stealth damage regions together, and expanding the wafer to separate individual dies from the wafer.

In a method for preparing a workpiece for subsequent laser welding, a recessed structure in the form of at least two grooved line elements is formed by a laser beam in a surface of the workplace, with the line elements having a common starting point from which the laser beam moves onwards to produce the line elements. Solidifying material melt of the workpiece is hereby accumulated in an area of the starting point to produce a nub-like elevation sized to extend out beyond the surface of the workpiece.

A laser head apparatus that enables switching between a laser beam and a purging stream. The laser head apparatus includes a bracket that provides for translation and rotation of the laser optics and purging nozzle. The laser optics and purging nozzle are located on opposite sides of the bracket and may be rotated to different rotational positions around a center axis of the bracket and translated to different linear positions along a length of the bracket. Methods of removing material using the laser head apparatus to between a laser beam and a purging stream are also provided.

The invention relates to a bridge (B) for laser cutting machines. In the latter, a laser cutting head (K) is guided over a workpiece support (W) by means of a guide system. The bridge (B) is configured in the form of a substantially straight and box-like profile (1) which has at least one guide for a cutting carriage carrying the laser cutting head (K). According to the invention, at least two side faces (10, 11) of the profile (1) that are located opposite one another with regard to the vertical plane of symmetry (VSE) of the bridge enclose a non-zero angle (a) of less than 180° that opens in the direction of the machining region, at least over a part of the height of said profile (1).

A processing apparatus includes: a beam irradiation apparatus that is configured to irradiate an object with an energy beam; and a beam deflection apparatus that is configured to change a propagating direction of the energy beam toward the beam irradiation apparatus, wherein when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a first direction, the beam irradiation apparatus emits the energy beam in a second direction, and when the energy beam propagating toward the beam irradiation apparatus from the beam deflection apparatus propagates in a third direction that is different from the first direction, the beam irradiation apparatus emits the energy beam in a fourth direction that is different from the second direction.

A method for matching and tracking workpieces in laser etching operation includes generating by the computer a label image that uniquely identifies the workpiece, moving a laser head to the workpiece, setting the laser head to a first power level by a power controller, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with a product image in a pixel wise fashion across the workpiece, moving the laser head to the label by the transport mechanism, setting the laser head to a second power level by the power controller, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in accordance with the label image in a pixel wise fashion across the label.

An apparatus for laser materials processing including a laser (4) for generating a laser beam and a laser head (5) which is movable along at least one spatial direction and is connected to the laser via a light guide, and which emits a laser beam (7) capable of processing a material. The present invention also relates to an apparatus for selective laser melting or selective laser sintering having an apparatus for laser materials processing.