A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.

Disclosed are laser bonding apparatuses and methods, The laser bonding apparatus comprises a stage configured to receive a substrate, a laser device that may be disposed on the stage and is configured to irradiate a laser beam onto the substrate, a first rotation support disposed outside of the stage and is configured to drivee the laser device to rotate in an azimuthal angle direction, and a second rotation support configured to support the laser device and configured to drive the laser device to rotate in a polar angle direction intersecting the azimuthal angle direction.

An additive manufacturing apparatus forms layers with a material that is molten to produce a formed object. The additive manufacturing apparatus includes a CMT power supply that supplies as a power supply current to heat a wire that is the material fed to a workpiece, to the material; a laser oscillator that produces as a beam source a laser beam that is a beam with which the workpiece is irradiated; and a head drive unit that shifts as a drive unit a feed position for the material on the workpiece and an irradiation position for the beam on the workpiece. The additive manufacturing apparatus shifts the feed position and the irradiation position, with the irradiation position leading in a moving path for the feed position in spaced relation to the feed position.

Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.

An additive manufacturing apparatus forms layers with a material that is molten to produce a formed object. The additive manufacturing apparatus includes a CMT power supply that supplies as a power supply current to heat a wire that is the material fed to a workpiece, to the material; a laser oscillator that produces as a beam source a laser beam that is a beam with which the workpiece is irradiated; and a head drive unit that shifts as a drive unit a feed position for the material on the workpiece and an irradiation position for the beam on the workpiece. The additive manufacturing apparatus shifts the feed position and the irradiation position, with the irradiation position leading in a moving path for the feed position in spaced relation to the feed position.

A pair of separators is overlapped and placed on a base jig and thereby positioned with each other. Respective through-holes thereof are positioned to the position of a pin hole provided in the base jig. When a main jig is pressed against the base jig to clamp the pair of separators, and a pin of a sub-jig is inserted into the pin hole to clamp the pair of separators by a head, an annular light guiding path is formed by a gap generated between an opening provided in the main jig and the head of the sub-jig, and hence a laser welding position which surrounds the through-holes is exposed. The surrounding of each through-hole is seamlessly laser-welded when the laser welding position is irradiated with a laser beam.

Provided is an apparatus for coating a girth weld and a cutback region surrounding said girth weld, said apparatus having lateral travel at least equal to the length of the cutback region and circumferential rotational travel around the pipe. The apparatus can provide a multiple component coating accurately and safely, without the need for solvent flushing of the apparatus.

A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.

The present inventing relates to a method for marking at least one inner face of a container with at least one given pattern, in which method the inside of said inner face is at least partially coated with a pigmented sol-gel layer that reacts to laser radiation, by spraying or by means of a stamp applied to a precise zone of the layer provided for containing the pattern, and the pattern is developed by interaction between the sol-gel and UV laser radiation specifically programmed according to the pattern to be revealed, the UV laser radiation being emitted by a device comprising an optical system having a long optical length that allows a field depth of more than 1 mm to be obtained. The present invention also relates to a device suitable for implementing this method and to a container obtained by this method.

A method for manufacturing an electronic apparatus, includes: providing a preliminary electronic module including an active area having a hole-forming area, and a peripheral area adjacent to the active area; emitting a laser beam while rotating a laser source along a moving path defined along a boundary between the hole-forming area and the active area, the moving path being divided into a first section and a second section; and removing the hole-forming area from the preliminary electronic module to form an electronic module having a module hole. During a first rotation of the laser source along the moving path, the laser beam is not emitted on the first section, and the laser beam is emitted on the second section.