In a method of providing a flow for a process chamber of a device for producing a three-dimensional object by layer-wise application and selective solidification of a building material in a build area a process gas is supplied to the process chamber in a lower altitude region of the process chamber, wherein the process chamber includes a gas inlet for introducing the process gas into the process chamber and a gas outlet for discharging the process gas from the process chamber. The gas inlet and the gas outlet are provided in the lower altitude region of the process chamber and the process gas flows in a main flow from the gas inlet to the gas outlet, and wherein a secondary flow is located in a sub-region of the lower altitude region, which sub-region is located above a bottom surface of the process chamber surrounding the build area.

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, software, and systems, some of which utilize one or more detectors that may be used to detect characteristics of the 3D object, e.g., in real-time during its formation. The present disclosure provides methods, apparatuses, software, and systems for generating different cross sections of one or more energy beams used for 3D printing of the 3D object.

A laser marking system for marking a product comprising a laser source for providing a laser beam, a marking head for projecting the laser beam on to the product, a housing comprising an extraction device configured to generate a flow of extraction fluid for extracting matter generated by an interaction between the laser beam and the product, and a controller for controlling the laser source and the marking head. The laser marking system further comprises an umbilical assembly connecting the housing to the marking head.

Laser processing head (20) of the present disclosure includes housing (30), transparent protector (40), and temperature sensor (70). Housing (30) includes an optical path of processing laser light (LB). Transparent protector (40) is detachably fixed to housing (30), passes processing laser light (LB), and suppresses dust of work material (W) entering into housing (30). Here, the dust is generated from the work material (W) irradiated with processing laser light (LB). Temperature sensor (70) detects the temperature of transparent protector (40).

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

A method is disclosed for additive manufacturing a three-dimensional object layer-by-layer including depositing a layer of material on a bed surface or a previously deposited layer of the object to form the object layer-by-layer; providing energy to the material after each layer is deposited with the energy being provided by an energy source that forms an energized beam directed at the material; altering a property of a gas surrounding the material and through which the energized beam extends to alter a property of the object constructed from the material; melting the material with the energized beam to form a melted pool of liquefied material; and allowing the material to solidify to bond the material to a previous layer of material of the object.

Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.

A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from a laser beam emission port of the laser oscillator to a workpiece, an impure gas absorbent for absorbing impure gases that influence the propagation of the laser beam, and a shutter that exposes the impure gas absorbent in the laser optical path.

A flow control device for an additive manufacturing system is provided. The flow control device includes a gas supply configured to discharge a gas, a first flow modifier configured to modify at least one flow characteristic of a first portion of the gas, and a second flow modifier configured to cooperate with the first flow modifier to modify the at least on flow characteristic of the first portion of the gas. The second flow modifier is further configured to modify at least one flow characteristic of a second portion of the gas, and the first flow modifier and the second flow modifier are configured to cooperate to direct at least a portion of the first portion and the second portion of the gas towards a melt pool in a plurality of particles.

A laser cutting tool with protective enclosure assembly for manipulating a workpiece on a movable platen includes a frame, a top protection assembly, a middle protection shield, a bottom protection assembly and a laser torch head. The top protection assembly, middle protection assembly, and bottom protection assembly are removably mounted to the frame such that they form a cavity enclosing only substantially the laser torch head.