The present disclosure provides three-dimensional (3D) printing methods, apparatuses, software, and systems, some of which utilize one or more detectors that may be used to detect characteristics of the 3D object, e.g., in real-time during its formation. The present disclosure provides methods, apparatuses, software, and systems for generating different cross sections of one or more energy beams used for 3D printing of the 3D object.

A laser annealing apparatus, a fabrication method of a polysilicon thin film, and a fabrication method of a thin film transistor are provided. The laser annealing apparatus includes: a laser generator, an optical system and an annealing chamber. The laser generator is configured to emit a laser beam, and the laser beam is guided to the annealing chamber via the optical system. The optical system includes a beam splitter, the beam splitter decomposes the laser beam into a first beam and a second beam, an energy density of the first beam is greater than an energy density of the second beam, and the first beam and the second beam are guided into the annealing chamber for laser annealing.

A method and apparatus for the generative production of a three-dimensional component in a processing chamber are disclosed. The method performs the steps of providing a metal starting material in the processing chamber and melting the starting material by inputting energy, which are repeated multiple times. A process gas is passed through the processing chamber in a circuit. Hydrogen is added to the circulating gas, then the circulating gas is heated to a temperature above 500 C. and then cooled to a temperature below 60 C.

A method is provided for operating a laser system. During an embodiment of this method, inert gas is directed against an object within a cavity of a collection device. An aperture is formed in the object by ablating the object with a laser beam that travels within the cavity and to the object. Byproducts of the ablation are removed from the cavity. During another embodiment of the method, inert gas is pooled against an object and a gas curtain is provided proximate a lens. The object is cut using a laser beam which travels from the lens, through the gas curtain and the pooled inert gas, to the object. Fumes and/or particulates produced by the formation are directed away from the laser beam.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

A protection cover suitable for being placed between a spray nozzle and a metal part during a process of resurfacing the metal part, the protection cover including a side wall extending along a reference axis, the side wall including an inner surface and an outer surface, the side wall having a lower end and an upper end, the side wall being perforated by at least one lateral gas inlet port, the lower end of the side wall being perforated by a notch into which a portion of the metal part can be inserted, the upper end of the side wall being provided with an opening into which a portion of the spray nozzle can be inserted. The inner surface of the side wall includes at least one frustoconical portion.

A laser machining device having a surface plate upon which a material to be machined is placed, a rail, a saddle, a garter, a horizontal carriage, and a laser nozzle. On it is attached: a machining trolley that causes the saddle to travel along rail, causes the horizontal carriage to travel horizontally along garter, irradiates laser light from laser nozzle towards a material to be machined, and cuts or welds the material. A cover is provided that covers substantially the entire surface of machining trolley and has an upper surface cover, a laser nozzle-side cover, a garter-side cover, and a side surface body. On a lower end side of the laser nozzle-side cover and the garter-side cover, there is a flexible light-blocking member for preventing laser light from leaking from a gap between the lower end section and the upper surface of the surface plate.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

A laser marking system for marking a product includes a marking head having an electromagnetic radiation steering mechanism configured to steer electromagnetic radiation to address a specific location within a two-dimensional field of view. The electromagnetic radiation steering mechanism comprises a first optical element having an associated first actuator configured to rotate the first optical element about a first rotational axis to change a first coordinate of a first steering axis in the two-dimensional field of view and a second optical element having an associated second actuator configured to rotate the second optical element about a second rotational axis to change a second coordinate of a second steering axis in the two-dimensional field of view. The electromagnetic radiation steering mechanism comprises an electromagnetic radiation manipulator configured to introduce a difference between a first angle and a second angle (defined between the first and second rotational and steering (respectively) axes).

Devices and methods for optical-fiber processing for connector applications are disclosed, wherein the devices and methods utilize a quantum cascade laser operated under select processing parameters to carry out end face polishing. The method includes supporting the optical fiber in a ferrule so that a bare end section of the fiber protrudes from an end of the ferrule by a protrusion distance. The method then includes irradiating the end face with light from the quantum cascade laser to polish the end face. The quantum cascade laser can also be used to form a bump in a central portion of the end face, wherein the bump facilitates physical contact between respective end faces of connected optical fibers.