Patent classifications
B23K26/1436
System and Method for Automated Laser Ablation
A system and method for automated laser ablation includes an end effector for performing laser ablation at a location with restricted access. The systems and methods of the present disclosure specifically provide for a miniature laser end effector which may be inserted through a port or bore in order to ablate the surface of an internal component of a complex assembly. In several embodiments of the present subject matter, the end effector is mounted on an automated machine and coupled to a laser system.
Method for laser cutting with optimized gas dynamics
This disclosure relates to methods for cutting metal workpieces in sheet form with a thickness of at least 2 mm. A laser beam is positioned in a nozzle opening of a cutting gas nozzle configured to cut via the laser beam and a cutting gas so that a beam axis of the laser beam along a direction of propagation of the laser beam is at least a distance of 3 mm from a rear opening wall portion of the nozzle opening. Cutting gas configured for concurrently exiting the nozzle opening with the laser beam is emitted through the nozzle opening at a cutting gas pressure (p) of at most 10 bar.
LASER PROCESSING SYSTEM, JET ADJUSTMENT DEVICE, AND LASER PROCESSING METHOD
A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; and a tubular enclosure disposed between the nozzle and a workpiece and enclosing the jet, wherein the enclosure has a changeable radial inner dimension, and is configured to adjust the position of the maximum point by changing the inner dimension.
MACHINING CONDITION ADJUSTMENT DEVICE AND MACHINE LEARNING DEVICE
A machining condition adjustment device adjusts laser beam machining conditions for a laser beam machining device to carry out laser beam machining of a workpiece, produces each of state variables including machining condition data, workpiece data, and plasma generation amount data and determination data including plasma generation amount determination data, and learns adjustment action for the laser beam machining conditions with respect to an amount of plasma generated in the laser beam machining of the workpiece under prescribed laser beam machining conditions, with use of the produced state variables and the produced determination data.
LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD
A laser processing system capable of reliably determining an abnormality in a jet during laser process. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure any of the velocity of the jet and a sound generated by the jet impinging on a workpiece; and an abnormality determination section configured to determine whether or not output data of the measuring instrument is different from reference data.
LASER PROCESSING SYSTEM, JET OBSERVATION APPARATUS , LASER PROCESSING METHOD, AND JET OBSERVATION METHOD
A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to forming a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure the velocity of the jet; and a position acquisition section configured to acquire information representing a position of the maximum point based on output data of the measuring instrument.
PORTABLE DEVICE FOR LASER MARKING
A portable device for laser marking capable of detecting the presence of defects on the surface to be marked and/or its misplacement.
Machining condition adjustment device and machine learning device
A machining condition adjustment device adjusts laser beam machining conditions for a laser beam machining device to carry out laser beam machining of a workpiece, produces each of state variables including machining condition data, workpiece data, and plasma generation amount data and determination data including plasma generation amount determination data, and learns adjustment action for the laser beam machining conditions with respect to an amount of plasma generated in the laser beam machining of the workpiece under prescribed laser beam machining conditions, with use of the produced state variables and the produced determination data.
LASER CUTTING AND MACHINING METHOD FOR PLATED STEEL PLATE, LASER CUT-AND-MACHINED PRODUCT, THERMAL CUTTING AND MACHINING METHOD, THERMAL CUT-AND-MACHINED PRODUCT, SURFACE-TREATED STEEL PLATE, LASER CUTTING METHOD, AND LASER MACHINING HEAD
A laser cutting and machining method for plated steel plated, when irradiating a laser beam LB on to the upper surface of a plated steel plate W and laser cutting and machining same: a plating layer-containing metal that has been melted and/or evaporated by the irradiation of the laser beam LB is caused to flow on to a cut surface of the plated steel plate W as a result of assist gas that is jetted towards a laser machining units; and the plating layer-containing metal is coated on the cut surface.
Device for Protecting Laser Optics
A device for the protection of laser optics or to their lifetime increase. The device for the protection of laser optics comprises a housing arranged below a laser optics housing with a connection for the supply of a cutting gas, an on the opposite side to the laser optics outlet nozzle for the cutting gas and a pressure-resistant protective glass on the side of the laser optics and a process-side protective glass, which is arranged between the nozzle and pressure-resistant protective glass available.