A method for manufacturing a continuous casting mold in which cracking and spalling are less likely to occur in a filling laminate. The method includes filling a plurality of concave portions formed on an inner surface of a copper-made mold copper plate or a copper alloy-made mold copper plate used for continuously casting steel at least in a region including a meniscus position of molten steel in a casting process with a metal having a thermal conductivity different from that of the mold copper plate.

A multifunctional laser processing apparatus includes a hollow milling shaft, a light path tool holder, a tool-holder-type melting module, a laser light source, and a temperature sensor. The hollow milling shaft includes a first light path channel and a connection portion. The light path tool holder can be connected to the connection portion. The light path tool holder has a second light path channel communicating with the first light path channel. The tool-holder-type melting module can be connected to the connection portion. The tool-holder-type melting module has a third light path channel communicating with the first light path channel. The laser light source is configured to emit a laser light beam toward the first light path channel. The temperature sensor is disposed on an outer surface of the hollow milling shaft and is configured to sense a temperature of a work piece during a multifunctional processing process.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

A laser welding system for welding a component and reducing defects in the weld by ensuring uniform, laminar gas flow over a process area of the system. The laser welding system comprises a laser for welding the component, a platform for supporting the component, an enclosure surrounding the platform, a first actuatable barrier, a second actuatable barrier, an actuator, and a controller. The enclosure includes a plurality of walls, one of the walls having an inlet and another wall having an outlet. The inlet and outlet each having an opening having a cross-sectional area for letting gas flow through. The first and second barriers are configured to modify the cross-sectional areas of the openings when actuated. The actuator is configured to actuate the barriers, and the controller is configured to direct the actuator to actuate the barriers so that the cross-sectional area of the first opening is larger than the cross-sectional area of the second opening so that a pressure at the inlet is greater than a pressure at the outlet.

A laser cutting head includes a controllable collimator with movable collimator lenses for controlling beam diameter and/or focal point location. The laser cutting head may be used in a laser cutting system with a control system for controlling the position of the movable collimator lenses. The lenses may be moved, for example, to adjust the beam spot size for cutting different types of material or material thicknesses. The lenses may also be moved to adjust a focal point back to the workpiece after changing the distance of the laser cutting head relative to the workpiece.

Disclosed is a switching system for a facility for 3D printing by spraying at least a first powder, including a body defining: at least one first upstream gas conduit configured to receive a gas; at least one first upstream powder conduit configured to receive the first powder; at least one first downstream discharge conduit for discharging the first powder; and a downstream work conduit configured in order to supply a nozzle designed for depositing at least the first powder. The system further includes a distributor that is movable with respect to the body, preferably in rotation about an axis, between a rest position, in which the first upstream powder conduit is fluidly connected, via the distributor, to the first downstream discharge conduit, and at least a first supply position, in which the first upstream powder conduit is fluidly connected, via the distributor, to the downstream work conduit.

A chip removing device and a chip removing method are provided. The chip removing device includes: a carrier substrate, a laser generation module, and a blowing module. The carrier substrate carries at least one substrate, and a plurality of chips disposed on the substrate. The laser generation module corresponds to the carrier substrate and is used to apply a laser beam to the chip to reduce the bonding force between the chip and the substrate. The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate.

An assembly for rapid manufacturing of symmetrical objects by direct metal deposition is disclosed. A rotary stage provides rotational movement to an object supported by the stage around a central stage axis. Nozzles are spaced above the rotary stage for performing direct metal deposition for building an object supported by the stage. Each nozzle is independently moveable along a horizontal axis and independently pivotable, and combined, moveable along a vertical axis for providing symmetrical movement corresponding to a symmetrical deposition configuration of the object while the object is rotated around the central stage axis.

A system and method of monitoring a powder-bed additive manufacturing process is provided where a layer of additive powder is fused using an energy source and electromagnetic emission signals are measured by a melt pool monitoring system to monitor the print process. The measured emission signals are analyzed to identify outlier emissions and clusters of outliers are identified by assessing the spatial proximity of the outlier emissions, e.g., using clustering algorithms, spatial control charts, etc. An alert may be provided or a process adjustment may be made when a cluster is identified or when a magnitude of a cluster exceeds a predetermined cluster threshold.

An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.