A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.

A method for working a first component and a second component comprises the following steps: providing the first component, which comprises a thermally sprayed electrically conductive layer, providing the second component, which has a longitudinally extended strip of copper, which at least in a first region has a thickness transversely to the longitudinal direction of more than 0.1 millimeter, arranging the strip and the layer one on top of the other, so that the first region of the strip and the layer have a contact region in common with one another, emitting a laser beam onto the contact region and forming a welded connection, which connects the strip and the layer to one another.

The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. A system may include assembly cells each including an assembly track and assembly carriages that ride thereon and which engage components of partially-assembled cartridges. A transfer apparatus may transfer partially-assembled cartridges between the assembly cells. In another example system, cartridges may be assembled on platforms on a rotary track. The platforms may include assembly grippers with sequentially-opening clamps configured to receive the components of the partially-assembled cartridges. Related methods are also provided.

The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. A system may include assembly cells each including an assembly track and assembly carriages that ride thereon and which engage components of partially-assembled cartridges. A transfer apparatus may transfer partially-assembled cartridges between the assembly cells. In another example system, cartridges may be assembled on platforms on a rotary track. The platforms may include assembly grippers with sequentially-opening clamps configured to receive the components of the partially-assembled cartridges. Related methods are also provided.

The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

The described embodiments relate generally to printed circuit boards (PCBs) including a capacitor and more specifically to designs for mechanically isolating the capacitor from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Conductive features can be mechanically and electrically coupled to electrodes located on two ends of the capacitor. The conductive features can be placed in corners where the amplitude of vibrations created by the piezoelectric forces is relatively small. The conductive features can then be soldered to a land pattern on the PCB to form a mechanical and electrical connection while reducing an amount of vibrational energy transferred from the capacitor to the PCB.

A steel plate frame and a thin plate are made of different materials. A plurality of through holes are formed in a portion of the thin plate to be placed on the steel plate frame. A plurality of projections 6c are formed on a support plate, each of the projections being allowed to be inserted into a corresponding one of the through holes. An adhesive is applied to a portion of the steel plate frame on which the thin plate is placed. The thin plate is placed on the steel plate frame, and the steel plate frame and the thin plate are bonded together by the adhesive. The support plate is placed on the thin plate to insert the projections into the through holes. The projections and the steel plate frame are welded to form a plurality of welded spots.

A steel plate frame and a thin plate are made of different materials. A plurality of through holes are formed in a portion of the thin plate to be placed on the steel plate frame. A plurality of projections 6c are formed on a support plate, each of the projections being allowed to be inserted into a corresponding one of the through holes. An adhesive is applied to a portion of the steel plate frame on which the thin plate is placed. The thin plate is placed on the steel plate frame, and the steel plate frame and the thin plate are bonded together by the adhesive. The support plate is placed on the thin plate to insert the projections into the through holes. The projections and the steel plate frame are welded to form a plurality of welded spots.

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.