A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.

Provided is a teaching device including a grouping unit which divides machining points into machining point groups so that a machining head can sequentially machine each machining point for a machining time and so that a non-machining time can be minimized, a machining path determination unit which determines a machining path on which an in-group movement time of a robot is shortest for each machining point group, a teaching process adjustment unit which adjusts a machining order of the machining points and an operation order of the machining point groups so as to minimize a distance between groups and which optimizes the grouping so as to minimize a total movement time for completing machining, and a teaching data output unit which outputs, as teaching data, machining execution positions on the machining path obtained as a result of processing of the teaching process adjustment.

Embodiments of the present disclosure provide a mask assembly and a manufacturing method thereof. The mask assembly includes: a frame; a mask provided with a mask area and connection areas positioned on opposite sides of the mask area; and a plurality of first connection parts in each connection area, wherein the plurality of first connection parts in each connection area are arranged in M rows and N columns, each row includes a plurality of first connection parts, each column includes at least one first connection part, and in the same connection area, the first connection parts of any two adjacent rows are arranged in a staggered manner, where each of M and N is an integer larger than 1, and the mask is fixed to the frame via the plurality of first connection parts.

Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

A temperature sensor having a structure in which electrode wires are butted against signal wires with their weld portions and a method for manufacturing the temperature sensor. In a temperature sensor (1), outer circumferential portions (57a) and (57b) of each of weld portions (55) between electrode wires (25) and sheath core wires (3) are located outward of a first straight line D1 and a second straight line D2, respectively. A forward end-side length L1 is set to be longer than a rear end-side length L2. In addition, the sheath core wires (3) are larger in diameter than the electrode wires (25).

A temperature sensor having a structure in which electrode wires are butted against signal wires with their weld portions and a method for manufacturing the temperature sensor. In a temperature sensor (1), outer circumferential portions (57a) and (57b) of each of weld portions (55) between electrode wires (25) and sheath core wires (3) are located outward of a first straight line D1 and a second straight line D2, respectively. A forward end-side length L1 is set to be longer than a rear end-side length L2. In addition, the sheath core wires (3) are larger in diameter than the electrode wires (25).

Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.

An electrical and/or electronic component including at least one electrical outside connecting contact. This contact is a terminal lug, which is attached at one side, for the electrical contacting with a contacting partner. The terminal lug includes a connecting side including a planar connecting surface for the electrical contacting. The exposed end of the terminal lug includes a bending leg, which is bent out of the plane by a compensating angle toward the connecting side. The bending leg includes the connecting surface. The terminal lug is designed such that, when a contacting partner, which is planar at least in this area, makes site contact with the free end of the bending leg with a force applied from the connecting side, a position orientation of the connecting surface is adaptable counter to the compensating angle until a gap-free contact is made between the connecting surface and the planar contacting partner.

A battery bridge for an electronic device, preferably for an electronic implant, has an electrically conductive first contact element, an electrically conductive second contact element and an insulator. The first contact element and the second contact element comprise a weldable material. In a first state of the battery bridge, the first contact element is distanced from the second contact element via a predefined air gap and the first contact element is electrically insulated from the second contact element by the air gap and the insulator. The battery bridge is formed in such a way that it can be transferred, by welding the first contact element and the second contact element together, into a second state, in which the air gap between the first contact element and the second contact element is closed electrically conductively, at least in part. A method for activating such an electronic device is also disclosed.