The present invention relates to a motor vehicle luminous device including at least one first portion that is transparent to at least one laser beam, the portion having at least one first polymer material, and at least one second portion that absorbs the laser beam and is transparent to at least some of the visible spectrum, including at least one second polymer material, the second portion being laser welded to the first portion.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.

Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.

A protrusion on a first member made of synthetic resin wherein a laser beam is applied to a side surface of the protrusion in a state in which a top surface of the protrusion of the first member is abutted against a second member made of synthetic resin, so as to melt at least the entire top surface of the protrusion and melt a portion of the second member in contact with the protrusion by heat of the melted top surface of the protrusion, followed by solidification of the melted portions, whereby the first member and the second member are welded together.

A new ultrasonic aided laser joining method (UAL) for bonding dissimilar materials has been developed. The method is capable of eliminating the laser-induced bubbles at the bonding faces and to improve the joint strength over that of the conventional laser-assisted metal and plastic joining method (LAMP). Some experiments on joining titanium to polyethylene terephthalate have been conducted to show the superiority of UAL over LAMP. The results showed that the joint strength, measured in terms of failure load, was significantly increased when ultrasonic vibration was employed during laser joining. For the LAMP joined specimens, fracture normally occurred at the metal-plastic interface, whereas for the UAL joined specimens, fracture normally occurred in the parent plastic part. The improvement in joint strength is mainly due to the elimination of pores in the resolidified plastic. In addition, ultrasound vibration promotes chemical bonding between the plastic and metal parts, and this is supported by the XPS results.

A new ultrasonic aided laser joining method (UAL) for bonding dissimilar materials has been developed. The method is capable of eliminating the laser-induced bubbles at the bonding faces and to improve the joint strength over that of the conventional laser-assisted metal and plastic joining method (LAMP). Some experiments on joining titanium to polyethylene terephthalate have been conducted to show the superiority of UAL over LAMP. The results showed that the joint strength, measured in terms of failure load, was significantly increased when ultrasonic vibration was employed during laser joining. For the LAMP joined specimens, fracture normally occurred at the metal-plastic interface, whereas for the UAL joined specimens, fracture normally occurred in the parent plastic part. The improvement in joint strength is mainly due to the elimination of pores in the resolidified plastic. In addition, ultrasound vibration promotes chemical bonding between the plastic and metal parts, and this is supported by the XPS results.

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.