There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

A resin pipe 30 and a resin member 31 are fixed to a setting portion 5 provided on the front side of a base 6, and a timing pulley 13 which is provided on the back side of the base 6 and to which a light emission unit 3 is attached is rotated. As a result, the light emission unit 3 applies laser light 20 to a junction 32 between the resin pipe 30 and the resin member 31 while revolving around the junction 32. This makes it easy to fuse and join the entire outer circumferential surface of the resin pipe 30 with the entire inner circumferential surface of the resin member 31, which are variously shaped and sized.

An optical wheel assembly for a laser transmission welding apparatus includes a double-convex optical lens having two spherical surfaces that are joined by a polished side surface extending circumferentially around the lens. Each of the two spherical surfaces has a known spherical diameter. The optical lens is disposed between a pair of dish cup holders, each having a spherical concave surface with the known spherical diameter and engaging the spherical surfaces of the lens. Each dish cup holder has an axial projection extending away from a side of the dish cup holder that is opposite the spherical concave surface. The axial projections are received within respective bearings that are mounted within a housing. The bearings allow the dish cup holders and the optical lens to rotate while pressure is being applied to plastic workpieces during laser transmission welding thereof.

An additive manufacturing system is disclosed that heats a feedstock and a workpiece in preparation for depositing and tamping the feedstock onto the workpiece. The system comprises a first laser/optical instrument pair for precisely heating the feedstock and a second laser/optical instrument pair for precisely heating the workpiece. The laser beam from each laser is shaped into an ellipse and each beam is rotated around an angle of rotation to ensure that the feedstock and the workpiece are properly heated. The system employs feedforward, a variety of sensors, and feedback to adjust the angle of rotation of each laser beam.

A method for directly bonding a metal to a transparent substrate includes providing a substrate; placing a metal foil directly on a face of the substrate; irradiating a portion of the metal foil with a laser beam so that metal corresponding to the portion melts and bonds directly to the substrate and forms a metal pad; and pumping a gas above the portion to prevent oxidation of the melted metal.

A method for directly bonding a metal to a transparent substrate includes providing a substrate; placing a metal foil directly on a face of the substrate; irradiating a portion of the metal foil with a laser beam so that metal corresponding to the portion melts and bonds directly to the substrate and forms a metal pad; and pumping a gas above the portion to prevent oxidation of the melted metal.

A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q.sub.1) of the contact area from the radiative reflection.

A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.

A device for fabricating a quartz microfluidic chip by a femtosecond pulse cluster. The device includes: a femtosecond pulse cluster laser source configured to output a femtosecond pulse cluster; a beam splitting and interference system, configured to split the femtosecond pulse cluster into a plurality of parts, and to converge split parts to form a femtosecond pulse cluster plasma or a femtosecond pulse cluster plasma grating; a sample system configured to move the electronic displacement platform where a quartz glass is placed to control a position where the parts of the femtosecond pulse cluster are converged on the quartz glass; and a hydrofluoric acid immersion system configured to immerse the quartz glass in a diluent hydrofluoric acid solution to remove an ablated part of the quartz glass to form the quartz microfluidic chip.

An encapsulation structure of a power module is disclosed in this application, which includes a power module and a liquid cooler. The power module includes a power module body, a metal baseplate, and heat dissipation finned tubes. A front side of the metal baseplate is connected to the power module body, and a back side of the metal baseplate is connected to the heat dissipation finned tubes. The metal baseplate has a protrusion part protruding. There are a plurality of grooves on a fluid pipe of the liquid cooler, a cavity exists between two adjacent grooves of the plurality of grooves, and the cavity is configured to communicate the two adjacent grooves. The power module body is lapped on the groove, a back side of the protrusion part is in contact with an edge surface of the groove, and the heat dissipation finned tubes are placed in the groove.