The disclosure relates to methods and systems incorporating physical modeling to identify the ultrafast laser/material interaction mechanisms and the impact of laser parameters, to optimize implementation of ultrafast laser-based processing for a given material. The process determines a laser fluence near the ablation threshold for a given material and given pulse duration. The repetition rate, scanning speed and scanning strategy are subsequently optimized to minimize heat accumulation, having an operable line scan overlap between 50% to 85% for achieving smooth ultrafast-laser polishing, while maintaining an optic-quality surface.

A method for laser-marking an iron-based sintered body includes a first step of forming with a first laser beam a plurality of dotted recesses with a predetermined depth in an identification mark area of a surface of an iron-based sintered body, and a second step of flattening with a second laser beam the surface within the identification mark area other than the dotted recesses. The first laser beam has an irradiation energy per unit area greater than an irradiation energy per unit area of the second laser beam.

A spacer wafer for producing spacers of electro-optical converter housings is provided. The spacer wafer is a transparent glass plate having a multiplicity of openings separated from one another and distributed in a grid so that singulated spacers are obtainable by severing sections of the glass plate along separating lines between the openings. The openings have side walls with microstructuring that has a roughness with an average roughness value R.sub.a of less than 0.5 μm with a measurement distance of 500 μm.

Provided is a laser mark printing method and a method of producing a laser-marked silicon wafer that can reduce the machining strain left around dots constituting a laser mark. In a method of printing a laser mark having a plurality of dots on a silicon wafer, the plurality of dots are formed using laser light having a wavelength in the ultraviolet region.

The invention relates to a method for producing an axle housing of a vehicle axle, by means of integrally connecting an axle tube (1) to an axle shaft (2) which is positioned on the longitudinal axis (L) of the axle tube, is equipped with bearing surfaces (3) for mounting a vehicle wheel, and has a tube cross-section facing said axle tube (1) which is substantially the same as the tube cross-section of the axle tube. In order to develop a welding method for the production of an axle housing that consists of an axle tube and an axle shaft secured thereto, which method is optimised in terms of the dynamic loads to which the axle housing is typically subjected in a driving operation, the method comprises the following steps: •—arranging the axle tube (1) and the axle shaft (2), with the abutting surfaces of their tube cross-sections positioned coaxially to one another, in a workpiece receiving portion of a welding installation (10), said welding installation additionally comprising an arc welding device (11) and a laser welding device (12) which is operated in parallel, •—continuously miming a weld seam (20) in the peripheral direction of the tube cross-sections, both welding devices (11, 12) being directed, actively and from the outside, onto substantially the same peripheral section of the abutting surfaces, wherein the laser beam (S) meets the outside (14) of the tube at right angles, and intersects the longitudinal axis (L) of the axle tube (1), and •—stopping running the weld seam (20) once this has passed over a peripheral angle of at least 360°. A corresponding axle housing is also disclosed.

The present invention relates to a device as well as a method for the additive manufacture of components by deposition of material layers by layer-by-layer joining of powder particles to one another and/or to an already produced pre-product or substrate, via selective interaction of the powder particles with a high-energy beam, wherein, for smoothing a surface of the component being produced running crosswise to the deposited material layers in between the deposition of two layers of the component, the complete edge region of the last layer that is applied and that runs along a surface of the component being produced is compacted in a direction of action that has a directional component parallel to the build-up direction of the layers, and/or at least one edge region (19) of a surface of the component (3′) is also compacted.

When a laser beam is used to perform shape processing on an edge surface of a disk-shaped glass plate, in order to suppress strain (retardation values) in the main surface of the glass plate, the disk-shaped glass plate is floated above a base, and the edge surface of the glass plate is processed into a target shape by irradiating the edge surface with the laser beam while contactlessly heating the glass plate in a state where the glass plate is floated, and moving the laser beam relative to the edge surface in the circumferential direction of the disk-shaped glass plate.

A substrate processing system includes a laser processing apparatus including a holder and a radiation unit, the holder being configured to hold a substrate including a base substrate, an irregularity pattern formed on a main surface of the base substrate, and an irregularity layer formed along the irregularity pattern, the radiation unit being configured to radiate a laser beam to a protrusion of the irregularity layer to flatten the irregularity layer by removing the protrusion in a state that the substrate is held by the holder; a controller configured to control a position of an irradiation point of the laser beam; and a polishing apparatus configured to polish the irregularity layer in which the protrusion is removed with the laser beam to be flattened.

The present disclosure relates to a high-precision and high-efficiency laser polishing method oriented to a large-size ultra-thin mask plate, and belongs to the technical field of advanced laser manufacturing. A high-precision and high-efficiency laser polishing technology is applied to the surface smoothness improvement of the large-size ultra-thin mask plate. The high-precision and high-efficiency laser polishing method specifically comprises the four following steps: step one, selecting and placing an ultra-thin invar alloy mask plate on a five-axis machining platform; step two, adopting a nanosecond continuous laser, and setting a laser incident angle; step three, setting N laser polishing areas; and step four, performing laser polishing continuous splicing. Compared with the prior art, the surface smoothness of the mask plate is improved, the polishing efficiency is high, the precision is high, and the influence on the geometrical characteristic size of the appearance of an original mask plate is low.

Methods, devices, and systems for beam processing of plate-shaped or tubular workpieces are provided. In one aspect, a method includes: generating at least one section of a cutting gap cutting through the workpiece along a cutting line corresponding to at least part of a contour of a workpiece part to be produced from the workpiece by a processing beam, and performing at least one non-joining and non-cutting finishing treatment of the workpiece with a partially cut-out workpiece part at least in one section of at least one finishing zone by the processing beam, the finishing zone extending along the cutting line.